LL

Lawrence P. Lehman

IBM: 1 patents #1,866 of 5,464Top 35%
📍 Endicott, NY: #31 of 69 inventorsTop 45%
🗺 New York: #2,888 of 9,035 inventorsTop 35%
Overall (2004): #170,416 of 270,089Top 65%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6686664 Structure to accommodate increase in volume expansion during solder reflow David V. Caletka, Krishna Darbha, Donald W. Henderson, George H. Thiel 2004-02-03