HL

How T. Lin

IBM: 6 patents #157 of 5,464Top 3%
ET Endicott Interconnect Technologies: 1 patents #3 of 7Top 45%
📍 Binghamton, NY: #1 of 41 inventorsTop 3%
🗺 New York: #168 of 9,035 inventorsTop 2%
Overall (2004): #4,038 of 270,089Top 2%
7
Patents 2004

Issued Patents 2004

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
6828514 High speed circuit board and method for fabrication Benson Chan, John M. Lauffer, Voya R. Markovich, David L. Thomas 2004-12-07
6827505 Optoelectronic package structure and process for planar passive optical and optoelectronic devices Subhash L. Shinde, L. Wynn Herron, Mario J. Interrante, Steven P. Ostrander, Sudipta K. Ray +2 more 2004-12-07
6814503 Fiber optic assembly Richard R. Hall, Candido C. Tiberia 2004-11-09
6741778 Optical device with chip level precision alignment Benson Chan, Richard R. Hall, John H. Sherman 2004-05-25
6721187 Multi-layered high density connections Richard R. Hall, Christopher J. Majka, Norman Corey Seastrand, Matthew F. Seward, Ronald V. Smith 2004-04-13
6712261 Solid conductive element insertion apparatus Richard R. Hall, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith 2004-03-30
6712527 Fiber optic connections and method for using same Benson Chan, Mitchell S. Cohen, Paul F. Fortier, Ladd W. Freitag, Richard R. Hall +2 more 2004-03-30