Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6721187 | Multi-layered high density connections | Richard R. Hall, How T. Lin, Norman Corey Seastrand, Matthew F. Seward, Ronald V. Smith | 2004-04-13 |
| 6712261 | Solid conductive element insertion apparatus | Richard R. Hall, How T. Lin, Matthew F. Seward, Ronald V. Smith | 2004-03-30 |