Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6788859 | Laminate substrate containing fiber optic cables | Voya R. Markovich, Sandeep B. Sane | 2004-09-07 |
| 6759270 | Semiconductor chip module and method of manufacture of same | William Infantolino, Voya R. Markovich, George H. Thiel | 2004-07-06 |
| 6756662 | Semiconductor chip module and method of manufacture of same | William Infantolino, Voya R. Markovich, George H. Thiel | 2004-06-29 |
| 6747331 | Method and packaging structure for optimizing warpage of flip chip organic packages | William Infantolino, Li Li, Steven G. Rosser | 2004-06-08 |
| 6731012 | Non-planar surface for semiconductor chips | William L. Brodsky, George H. Thiel | 2004-05-04 |