Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6747331 | Method and packaging structure for optimizing warpage of flip chip organic packages | William Infantolino, Li Li, Sanjeev Sathe | 2004-06-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6747331 | Method and packaging structure for optimizing warpage of flip chip organic packages | William Infantolino, Li Li, Sanjeev Sathe | 2004-06-08 |