Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6747331 | Method and packaging structure for optimizing warpage of flip chip organic packages | William Infantolino, Steven G. Rosser, Sanjeev Sathe | 2004-06-08 |
| 6703303 | Method of manufacturing a portion of a memory | Gary Chen, Yongjun Jeff Hu | 2004-03-09 |
| 6693354 | Semiconductor structure with substantially etched nitride defects protruding therefrom | Gary Chen, Yongjun Jeff Hu | 2004-02-17 |