Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Shu-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng | 2017-05-02 |
| 9611143 | Method for forming chip package | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin | 2017-04-04 |
| 9426894 | Fabrication method of wiring structure for improving crown-like defect | I-MIN LIN, Po-Shen Lin | 2016-08-23 |
| 9395072 | Illumination device | Su-Tsai Lu, Wen-Yung Yeh, Sheng-Feng Chung, Bao-Shun Yau, Chen-Kun Chen | 2016-07-19 |
| 9356249 | Organic electronic device and electric field-induced carrier generation layer | Chih-Ming Lai, Chen-Kun Chen | 2016-05-31 |
| 9275958 | Chip package and method for forming the same | Yi-Min Lin, Shu-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng | 2016-03-01 |
| 9236320 | Chip package | Tsang-Yu Liu, Yen-Shih Ho, Ying-Nan Wen | 2016-01-12 |
| 9224790 | Illumination device | Wen-Yung Yeh, Su-Tsai Lu, Chen-Kun Chen | 2015-12-29 |
| 9165890 | Chip package comprising alignment mark and method for forming the same | Yen-Shih Ho, Shih-Chin Chen, Chien-Hui Chen, Chia-Ming Cheng, Wei-Luen SUEN +1 more | 2015-10-20 |
| 9142486 | Chip package and fabrication method thereof | Tsang-Yu Liu, Tzu-Min Chen | 2015-09-22 |
| 8993365 | Wafer packaging method | Kuo-Hua Liu, Yi-Cheng Wang, Sheng-Yen Chang | 2015-03-31 |
| 8919545 | Desiccating container | — | 2014-12-30 |
| 8890191 | Chip package and method for forming the same | Chuan-Jin Shiu, Po-Shen Lin | 2014-11-18 |
| 8789692 | Desiccating container | Cheng-Teng Hsu | 2014-07-29 |
| 8785956 | Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same | Chuan-Jin Shiu, Po-Shen Lin, Hui-Ching Yang, Chiung-Lin Lai | 2014-07-22 |
| 8760882 | Wiring structure for improving crown-like defect and fabrication method thereof | I-MIN LIN, Po-Shen Lin | 2014-06-24 |
| 8748926 | Chip package with multiple spacers and method for forming the same | Kuo-Hua Liu, Hsi-Chien Lin | 2014-06-10 |
| D676747 | Container | — | 2013-02-26 |
| 8116101 | Electronic device | Yung-Chih Kuo, Chung-Teng Wu | 2012-02-14 |
| 8109655 | Illumination device and operating method thereof and electronic apparatus having the same | Kuo-Lun Kao, Chung-Teng Wu | 2012-02-07 |
| 7087464 | Method and structure for a wafer level packaging | Dylan Yu, Gary Guan, Jolas Chen | 2006-08-08 |
| 6977826 | Voltage regulator and method for regulating voltage | Hsin-Kai Huang, Jin-Kae Jang, Wen-Jong Tu | 2005-12-20 |
| 6706638 | Method of forming opening in dielectric layer | Yun-Kuei Yang | 2004-03-16 |
| 4624388 | Liquid tank weld cavitation protection | James R. Fenwick | 1986-11-25 |
| 4589526 | Controllable fluid damper for fluid-containing tank | James R. Fenwick | 1986-05-20 |