Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu | 2017-05-02 |
| 9635270 | Method for performing image control in an electronic device, and associated apparatus | Po-Hao Huang, Yuan-Chung Lee | 2017-04-25 |
| 9620431 | Chip package including recess in side edge | Tsang-Yu Liu, Chi-Chang Liao, Yu-Lung Huang | 2017-04-11 |
| 9601460 | Chip package including recess in side edge | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin, Shu-Ming Chang, Tzu-Wen Tseng | 2017-03-21 |
| 9554113 | Video frame processing method | Po-Hao Huang, Yuan-Chung Lee, Chung-Hung Tsai, Chi-Cheng Ju, Ding-Yun Chen +1 more | 2017-01-24 |
| 9426386 | Method for performing preview control in an electronic device, and associated apparatus | Po-Hao Huang, Yuan-Chung Lee | 2016-08-23 |
| 9373597 | Chip package and method thereof | Yen-Shih Ho, Shu-Ming Chang | 2016-06-21 |
| 9349710 | Chip package and method for forming the same | Chien-Hui Chen, Tsang-Yu Liu, Chun-Wei Chang | 2016-05-24 |
| 9318461 | Wafer level array of chips and method thereof | Chun-Wei Chang, Kuei-Wei Chen, Chia-Sheng Lin, Chien-Hui Chen, Tsang-Yu Liu | 2016-04-19 |
| 9317958 | Auto-convergence system with active learning and related method and machine-readable medium thereof | — | 2016-04-19 |
| 9275958 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu | 2016-03-01 |
| 9177862 | Semiconductor stack structure and fabrication method thereof | Yen-Shih Ho, Hsin Kuan, Long-Sheng Yeou, Tsang-Yu Liu | 2015-11-03 |
| 9165890 | Chip package comprising alignment mark and method for forming the same | Yen-Shih Ho, Shih-Chin Chen, Yi-Ming Chang, Chien-Hui Chen, Wei-Luen SUEN +1 more | 2015-10-20 |
| 9123125 | Image processing method and associated apparatus | — | 2015-09-01 |
| 9064950 | Fabrication method for a chip package | Chia-Lun Tsai, Long-Sheng Yeou | 2015-06-23 |
| 9034681 | Chip package and method for forming the same | — | 2015-05-19 |
| 9018770 | Chip package | Tsang-Yu Liu | 2015-04-28 |
| 8849014 | Photographic system | — | 2014-09-30 |
| 8822325 | Chip package and fabrication method thereof | Ching-Yu Ni, Nan-Chun Lin | 2014-09-02 |
| 8803326 | Chip package | Tsang-Yu Liu | 2014-08-12 |
| 8779557 | Chip package and package wafer with a recognition mark, and method for forming the same | Tsang-Yu Liu, Chia-Sheng Lin, Po-Shen Lin | 2014-07-15 |
| 8766431 | Power MOSFET package | Baw-Ching Perng, Ying-Nan Wen, Shu-Ming Chang, Ching-Yu Ni, Yun-Ji Hsieh +2 more | 2014-07-01 |
| 8637970 | Chip package and fabrication method thereof | Chia-Lun Tsai, Long-Sheng Yeou | 2014-01-28 |
| 8633558 | Package structure for a chip and method for fabricating the same | Ta-Hsuan Lin, Chuan-Jin Shiu, Tsang-Yu Liu | 2014-01-21 |
| 8633091 | Chip package and fabrication method thereof | Chia-Lun Tsai, Tsang-Yu Liu | 2014-01-21 |