CC

Chia-Ming Cheng

XI Xintec: 29 patents #5 of 118Top 5%
ME Mediatek: 13 patents #202 of 2,888Top 7%
UM United Microelectronics: 2 patents #1,942 of 4,560Top 45%
FG Fourstar Group: 1 patents #27 of 44Top 65%
PO Portwell: 1 patents #9 of 26Top 35%
📍 New Taipei, TW: #123 of 10,472 inventorsTop 2%
Overall (All Time): #37,672 of 4,157,543Top 1%
61
Patents All Time

Issued Patents All Time

Showing 51–61 of 61 patents

Patent #TitleCo-InventorsDate
8604578 Chip package Hsin-Chih Chiu, Chuan-Jin Shiu, Bai-Yao Lou 2013-12-10
8541877 Electronic device package and method for fabricating the same Chia-Lun Tsai, Ching-Yu Ni, Tien-Hao Huang, Wen-Cheng Chien, Nan-Chun Lin +3 more 2013-09-24
8530985 Chip package and method for forming the same 2013-09-10
8431946 Chip package and method for forming the same Hsin-Chih Chiu, Chuan-Jin Shiu, Bai-Yao Lou 2013-04-30
8410599 Power MOSFET package Baw-Ching Perng, Ying-Nan Wen, Shu-Ming Chang, Ching-Yu Ni, Yun-Jui Hsieh +2 more 2013-04-02
8399963 Chip package and fabrication method thereof Chia-Lun Tsai, Tsang-Yu Liu 2013-03-19
8384174 Chip package Hsin-Chih Chiu, Chuan-Jin Shiu, Bai-Yao Lou 2013-02-26
8362515 Chip package and method for forming the same Chien-Hung Liu 2013-01-29
8295050 Dual CPU and heat dissipating structure thereof Hui-Hsuan Chuang 2012-10-23
6410357 Structure of critical dimension bar Kun-Yuan Chang 2002-06-25
6350994 Structure of critical dimension bar Kun-Yuan Chang 2002-02-26