Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8531039 | Micro pin grid array with pin motion isolation | Belgacem Haba, David B. Tuckerman, Teck-Gyu Kang | 2013-09-10 |
| 8525338 | Chip with sintered connections to package | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2013-09-03 |
| 8508036 | Ultra-thin near-hermetic package based on rainier | Kenneth Honer | 2013-08-13 |
| 8410618 | Microelectronic assembly with joined bond elements having lowered inductance | Belgacem Haba, Philip R. Osborn | 2013-04-02 |
| 8404520 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2013-03-26 |
| 8008785 | Microelectronic assembly with joined bond elements having lowered inductance | Belgacem Haba, Philip R. Osborn | 2011-08-30 |
| 7732912 | Semiconductor chip packages and assemblies with chip carrier units | — | 2010-06-08 |
| 7709968 | Micro pin grid array with pin motion isolation | Belgacem Haba, David B. Tuckerman, Teck-Gyu Kang | 2010-05-04 |
| 7521785 | Packaged systems with MRAM | Nicholas Colella | 2009-04-21 |
| 7149095 | Stacked microelectronic assemblies | Michael Warner, John Riley, David Gibson, Young Gon Kim, Belgacem Haba +1 more | 2006-12-12 |
| 7061122 | Components, methods and assemblies for multi-chip packages | Young Gon Kim, David Gibson, Michael Warner, Philip R. Osborn | 2006-06-13 |
| 6885106 | Stacked microelectronic assemblies and methods of making same | Craig Mitchell, John Riley, Michael Warner, Joseph Fjelstad | 2005-04-26 |
| 6765288 | Microelectronic adaptors, assemblies and methods | — | 2004-07-20 |
| 6534392 | Methods of making microelectronic assemblies using bonding stage and bonding stage therefor | Jim Behlen, Rene Kunz | 2003-03-18 |