Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6534392 | Methods of making microelectronic assemblies using bonding stage and bonding stage therefor | Philip Damberg, Rene Kunz | 2003-03-18 |
| 6521480 | Method for making a semiconductor chip package | Craig Mitchell, Mike Warner | 2003-02-18 |
| 6169328 | Semiconductor chip assembly | Craig Mitchell, Mike Warner | 2001-01-02 |