Issued Patents All Time
Showing 51–75 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736066 | Stacked microelectronic assemby with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-05-27 |
| 8709913 | Simultaneous wafer bonding and interconnect joining | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-04-29 |
| 8697569 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-04-15 |
| 8692118 | Reliable wire structure and method | Cyprian Emeka Uzoh | 2014-04-08 |
| 8686565 | Stacked chip assembly having vertical vias | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-04-01 |
| 8685793 | Chip assembly having via interconnects joined by plating | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-04-01 |
| 8686551 | Substrate for a microelectronic package and method of fabricating thereof | Belgacem Haba, Apolinar Alvarez, Jr. | 2014-04-01 |
| 8652935 | Void-free wafer bonding using channels | Ilyas Mohammed, Piyush Savalia, Vage Oganesian, Belgacem Haba | 2014-02-18 |
| 8637968 | Stacked microelectronic assembly having interposer connecting active chips | Belgacem Haba, Vage Oganesian, Ilyas Mohammed, Piyush Savalia | 2014-01-28 |
| 8609540 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Belgacem Haba | 2013-12-17 |
| 8610259 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2013-12-17 |
| 8610264 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2013-12-17 |
| 8598695 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2013-12-03 |
| 8587126 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2013-11-19 |
| 8531020 | Stacked packaging improvements | Belgacem Haba, Masud Beroz | 2013-09-10 |
| 8525314 | Stacked packaging improvements | Belgacem Haba, Masud Beroz | 2013-09-03 |
| 8512491 | Dual wafer spin coating | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2013-08-20 |
| 8486758 | Simultaneous wafer bonding and interconnect joining | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2013-07-16 |
| 8071424 | Substrate for a microelectronic package and method of fabricating thereof | Belgacem Haba, Apolinar Alvarez, Jr. | 2011-12-06 |
| 8067267 | Microelectronic assemblies having very fine pitch stacking | Belgacem Haba | 2011-11-29 |
| 7759782 | Substrate for a microelectronic package and method of fabricating thereof | Belgacem Haba, Apolinar Alvarez, Jr. | 2010-07-20 |
| 7534652 | Microelectronic elements with compliant terminal mountings and methods for making the same | Belgacem Haba, Ilyas Mohammed, Michael Warner, Jesse Thompson | 2009-05-19 |
| 7368818 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 2008-05-06 |
| 7368695 | Image sensor package and fabrication method | Teck-Gyu Kang, Michael Estrella, Jae M. Park, Kenneth R. Thompson, Belgacem Haba | 2008-05-06 |
| 7335995 | Microelectronic assembly having array including passive elements and interconnects | L. Pflughaupt, David Gibson, Young Gon Kim, Wael Zohni, Ilyas Mohammed | 2008-02-26 |