Issued Patents All Time
Showing 76–100 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7309910 | Micro lead frame packages and methods of manufacturing the same | Belgacem Haba | 2007-12-18 |
| 7224056 | Back-face and edge interconnects for lidded package | Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B. Tuckerman, Michael Warner | 2007-05-29 |
| 7202112 | Micro lead frame packages and methods of manufacturing the same | Belgacem Haba | 2007-04-10 |
| 6977440 | Stacked packages | L. Pflughaupt, David Gibson, Young Gon Kim, Wael Zohni, Ilyas Mohammed | 2005-12-20 |
| 6913949 | Stacked packages | L. Pflughaupt, David Gibson, Young Gon Kim | 2005-07-05 |
| 6897565 | Stacked packages | L. Pflughaupt, David Gibson, Young Gon Kim | 2005-05-24 |
| 6897090 | Method of making a compliant integrated circuit package | Thomas H. DiStefano, Konstantine Karavakis, John W. Smith | 2005-05-24 |
| 6885106 | Stacked microelectronic assemblies and methods of making same | Philip Damberg, John Riley, Michael Warner, Joseph Fjelstad | 2005-04-26 |
| 6870272 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 2005-03-22 |
| 6723584 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 2004-04-20 |
| 6602740 | Encapsulation of microelectronic assemblies | — | 2003-08-05 |
| 6603209 | Compliant integrated circuit package | Thomas H. DiStefano, Konstantine Karavakis, John W. Smith | 2003-08-05 |
| 6541874 | Encapsulation of microelectronic assemblies | Tan Nguyen, Thomas H. DiStefano | 2003-04-01 |
| 6525429 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 2003-02-25 |
| 6521480 | Method for making a semiconductor chip package | Mike Warner, Jim Behlen | 2003-02-18 |
| 6458628 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Thomas H. DiStefano | 2002-10-01 |
| 6359335 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | Thomas H. DiStefano, John W. Smith | 2002-03-19 |
| 6329224 | Encapsulation of microelectronic assemblies | Tan Nguyen, Thomas H. DiStefano | 2001-12-11 |
| 6255738 | Encapsulant for microelectronic devices | Thomas H. DiStefano, Mark Thorson, Zlata Kovac | 2001-07-03 |
| 6232152 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | Thomas H. DiStefano, John W. Smith | 2001-05-15 |
| 6218215 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Thomas H. DiStefano | 2001-04-17 |
| 6202299 | Semiconductor chip connection components with adhesives and methods of making same | Thomas H. DiStefano, Gus Karavakis, Zlata Kovac | 2001-03-20 |
| 6197665 | Lamination machine and method to laminate a coverlay to a microelectronic package | Thomas H. DiStefano, Tan Nguyen | 2001-03-06 |
| 6169328 | Semiconductor chip assembly | Mike Warner, Jim Behlen | 2001-01-02 |
| 6133639 | Compliant interface for semiconductor chip and method therefor | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 2000-10-17 |