Issued Patents All Time
Showing 26–50 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287164 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba | 2016-03-15 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-02-23 |
| 9245670 | Reliable wire method | Cyprian Emeka Uzoh | 2016-01-26 |
| 9224649 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2015-12-29 |
| 9153562 | Stacked packaging improvements | Belgacem Haba, Masud Beroz | 2015-10-06 |
| 9142508 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba | 2015-09-22 |
| 9125333 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2015-09-01 |
| 9099296 | Stacked microelectronic assembly with TSVS formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2015-08-04 |
| 9099479 | Carrier structures for microelectronic elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2015-08-04 |
| 9041133 | BSI image sensor package with embedded absorber for even reception of different wavelengths | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2015-05-26 |
| 9018769 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2015-04-28 |
| 9000600 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei +1 more | 2015-04-07 |
| 8937361 | BSI image sensor package with variable-height silicon for even reception of different wavelengths | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2015-01-20 |
| 8927337 | Stacked packaging improvements | Belgacem Haba, Masud Beroz | 2015-01-06 |
| 8916781 | Cavities containing multi-wiring structures and devices | Belgacem Haba, Ilyas Mohammed, Cyprian Emeka Uzoh | 2014-12-23 |
| 8847376 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-09-30 |
| 8847380 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-09-30 |
| 8841763 | Three-dimensional system-in-a-package | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-09-23 |
| 8835223 | Chip assembly having via interconnects joined by plating | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-09-16 |
| 8829680 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Belgacem Haba | 2014-09-09 |
| 8809190 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-08-19 |
| 8796135 | Microelectronic elements with rear contacts connected with via first or via middle structures | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-08-05 |
| 8796828 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2014-08-05 |
| 8791575 | Microelectronic elements having metallic pads overlying vias | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2014-07-29 |
| 8772946 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei +1 more | 2014-07-08 |