Issued Patents All Time
Showing 101–112 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6126428 | Vacuum dispense apparatus for dispensing an encapsulant | Thomas H. DiStefano | 2000-10-03 |
| 6080605 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Thomas H. DiStefano | 2000-06-27 |
| 6045655 | Method of mounting a connection component on a semiconductor chip with adhesives | Thomas H. DiStefano, Gus Karavakis, Zlata Kovac | 2000-04-04 |
| 6046076 | Vacuum dispense method for dispensing an encapsulant and machine therefor | Thomas H. DiStefano | 2000-04-04 |
| 5932254 | System for encapsulating microelectronic devices | Thomas H. DiStefano | 1999-08-03 |
| 5929517 | Compliant integrated circuit package and method of fabricating the same | Thomas H. DiStefano, Konstantine Karavakis, John W. Smith | 1999-07-27 |
| 5875545 | Method of mounting a connection component on a semiconductor chip with adhesives | Thomas H. DiStefano, Gus Karavakis, Zlata Kovac | 1999-03-02 |
| 5776796 | Method of encapsulating a semiconductor package | Thomas H. DiStefano, John W. Smith, Joseph Fjelstad, Konstantine Karavakis | 1998-07-07 |
| 5766987 | Microelectronic encapsulation methods and equipment | Thomas H. DiStefano | 1998-06-16 |
| 5663106 | Method of encapsulating die and chip carrier | Konstantine Karavakis, Thomas H. DiStefano, John W. Smith | 1997-09-02 |
| 5659952 | Method of fabricating compliant interface for semiconductor chip | Zlata Kovac, Thomas H. DiStefano, John W. Smith | 1997-08-26 |
| 5548091 | Semiconductor chip connection components with adhesives and methods for bonding to the chip | Thomas H. DiStefano, Gus Karavakis, Zlata Kovac | 1996-08-20 |