Issued Patents All Time
Showing 76–95 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767274 | Method to reduce defect/slurry residue for copper CMP | Chi-Chun Chen, Shih-Chang Chen | 2004-07-27 |
| 6753249 | Multilayer interface in copper CMP for low K dielectric | Ying-Ho Chen, Jih-Churng Twu | 2004-06-22 |
| 6576551 | Chemical mechanical polish planarizing method with pressure compensating layer | Chung-Shi Liu | 2003-06-10 |
| 6518183 | Hillock inhibiting method for forming a passivated copper containing conductor layer | Tien-I Bao, Ying-Ho Chen, Syun-Ming Jang | 2003-02-11 |
| 6472312 | Methods for inhibiting microelectronic damascene processing induced low dielectric constant dielectric layer physical degradation | Tien-I Bao, Syun-Ming Jang | 2002-10-29 |
| 6403464 | Method to reduce the moisture content in an organic low dielectric constant material | — | 2002-06-11 |
| 6383935 | Method of reducing dishing and erosion using a sacrificial layer | Cheng-Chung Lin, Chen-Hua Yu, Tsu Shih | 2002-05-07 |
| 6376377 | Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicity | Ying-Ho Chen, Jih-Churng Twu, Syun-Ming Jang | 2002-04-23 |
| 6372632 | Method to eliminate dishing of copper interconnects by the use of a sacrificial oxide layer | Chen-Hua Yu, Jih-Chung Twu, Tsu Shih | 2002-04-16 |
| 6350694 | Reducing CMP scratch, dishing and erosion by post CMP etch back method for low-k materials | Tien-I Bao, Syun-Ming Jang | 2002-02-26 |
| 6346476 | Method for enhancing line-to-line capacitance uniformity of plasma enhanced chemical vapor deposited (PECVD) inter-metal dielectric (IMD) layers | Syun-Ming Jang | 2002-02-12 |
| 6319809 | Method to reduce via poison in low-k Cu dual damascene by UV-treatment | Lain-Jong Li, Shwang-Ming Jeng, Syun-Ming Jang | 2001-11-20 |
| 6274483 | Method to improve metal line adhesion by trench corner shape modification | Ying-Ho Chen, Syun-Ming Jang | 2001-08-14 |
| 6271138 | Chemical mechanical polish (CMP) planarizing method with enhanced chemical mechanical polish (CMP) planarized layer planarity | Syun-Ming Jang | 2001-08-07 |
| 6268294 | Method of protecting a low-K dielectric material | Syun-Ming Jang, Shwangming Jeng | 2001-07-31 |
| 6255232 | Method for forming low dielectric constant spin-on-polymer (SOP) dielectric layer | Yao-Yi Cheng, Syun-Ming Jang | 2001-07-03 |
| 6187663 | Method of optimizing device performance via use of copper damascene structures, and HSQ/FSG, hybrid low dielectric constant materials | Chen-Hua Yu, Syun-Ming Jang, Yao-Yi Cheng | 2001-02-13 |
| 6159842 | Method for fabricating a hybrid low-dielectric-constant intermetal dielectric (IMD) layer with improved reliability for multilevel interconnections | Yao-Yi Cheng | 2000-12-12 |
| 6043152 | Method to reduce metal damage in the HDP-CVD process by using a sacrificial dielectric film | Syun-Ming Jang | 2000-03-28 |
| 5514350 | Apparatus for making nanostructured ceramic powders and whiskers | Bernard H. Kear, Ganesh Skandan, Horst Hahn | 1996-05-07 |