Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742231 | Movable wafer holder for film deposition chamber having six degrees of freedom | Hsuan-Chih Chu, Yen-Yu Chen, Yi-Ming Dai | 2023-08-29 |
| 11728226 | Deposition system and method | Hsuan-Chih Chu, Yen-Yu Chen, Yi-Ming Dai | 2023-08-15 |
| 11693327 | Apparatus and a method of forming a particle shield | — | 2023-07-04 |
| 11688615 | System and method for heating semiconductor wafers | Hsuan-Chih Chu, Yen-Yu Chen | 2023-06-27 |
| 11682639 | Semiconductor device and method of forming the same | Yen-Yu Chen, Chih-Wei Lin, Yi-Ming Dai | 2023-06-20 |
| 11681851 | Hierarchical density uniformization for semiconductor feature surface planarization | Venkata Sripathi Sasanka Pratapa, Jyun-Hong Chen | 2023-06-20 |
| 11669957 | Semiconductor wafer measurement method and system | Peng Chen, Yi-An Huang, Jyun-Hong Chen, Wei-Chung Hu, Shiang-Bau Wang +1 more | 2023-06-06 |
| 11600505 | Systems and methods for systematic physical failure analysis (PFA) fault localization | Peng Chen, Jyun-Hong Chen, Chien-Hui Chen | 2023-03-07 |
| 11574837 | Robot blade having multiple sensors for multiple different alignment tasks | Yen-Yu Chen | 2023-02-07 |
| 11502050 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin, Chun-Chih Lin | 2022-11-15 |
| 11492700 | Shutter disk having lamp, power, and/or gas modules arranged at the first side of the shutter disk of thin film deposition chamber | Yen-Yu Chen, Yi-Ming Dai | 2022-11-08 |
| 11469198 | Semiconductor device manufacturing method and associated semiconductor die | Ming-Ho Tsai, Jyun-Hong Chen, Chun-Chen Liu, Yu-Nu Hsu, Peng Chen +1 more | 2022-10-11 |
| 11460787 | Apparatus and a method of forming a particle shield | — | 2022-10-04 |
| 11454877 | Extreme ultraviolet light reflective structure including nano-lattice and manufacturing method thereof | Benny KU, Keith Kuang-Kuo Koai | 2022-09-27 |
| 11448970 | Lithography system and methods | Eng Hock LEE | 2022-09-20 |
| 11397385 | Apparatus and a method of forming a particle shield | — | 2022-07-26 |
| 11308016 | USB integrated circuit | Wen-Yu Tseng, Terrance Shiyang Shih | 2022-04-19 |
| 11182532 | Hierarchical density uniformization for semiconductor feature surface planarization | Venkata Sripathi Sasanka Pratapa, Jyun-Hong Chen | 2021-11-23 |
| 11094057 | Semiconductor wafer measurement method and system | Peng Chen, Shiang-Bau Wang, Yung-Jung Chang, Wei-Chung Hu, Yi-An Huang +1 more | 2021-08-17 |
| 11075179 | Semiconductor device and method of forming the same | Yen-Yu Chen, Chih-Wei Lin, Yi-Ming Dai | 2021-07-27 |
| 10916517 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin, Chun-Chih Lin | 2021-02-09 |
| 10788764 | Apparatus and a method of forming a particle shield | Chue-San Yoo, Ching-Yueh Chen | 2020-09-29 |
| 10762621 | Semiconductor wafer measurement method and system | Peng Chen, Shiang-Bau Wang, Yung-Jung Chang, Wei-Chung Hu, Yi-An Huang +1 more | 2020-09-01 |
| 10658315 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin, Chun-Chih Lin | 2020-05-19 |
| 10354965 | Bonding pad process with protective layer | Shih Wei Bih, Chun-Chih Lin, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin | 2019-07-16 |