Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9305966 | Backside structure and method for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2016-04-05 |
| 9287312 | Imaging sensor structure and method | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2016-03-15 |
| 9245912 | Method and apparatus for low resistance image sensor contact | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chun-Chieh Chuang +1 more | 2016-01-26 |
| 9224770 | Image sensor device and method | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2015-12-29 |
| 9184207 | Pad structures formed in double openings in dielectric layers | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2015-11-10 |
| 9165970 | Back side illuminated image sensor having isolated bonding pads | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2015-10-20 |
| 9147702 | Image sensor for mitigating dark current | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Shu-Ting Tsai | 2015-09-29 |
| 9142690 | Semiconductor device having a bonding pad and shield structure and method of manufacturing the same | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Jeng-Shyan Lin, Cheng-Ying Ho | 2015-09-22 |
| 9059061 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2015-06-16 |
| 9041206 | Interconnect structure and method | Shu-Ting Tsai, Dun-Nian Yaung, Cheng-Jong Wang, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2015-05-26 |
| 9013022 | Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2015-04-21 |
| 8987855 | Pad structures formed in double openings in dielectric layers | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2015-03-24 |
| 8969991 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2015-03-03 |
| 8952497 | Scribe lines in wafers | U-Ting Chen, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Jeng-Shyan Lin | 2015-02-10 |
| 8946849 | BSI image sensor chips with separated color filters and methods for forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Feng-Chi Hung | 2015-02-03 |
| 8941204 | Apparatus and method for reducing cross talk in image sensors | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Min-Feng Kao | 2015-01-27 |
| 8736006 | Backside structure for a BSI image sensor device | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Jeng-Shyan Lin, Chun-Chieh Chuang +1 more | 2014-05-27 |
| 8710612 | Semiconductor device having a bonding pad and shield structure of different thickness | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Jeng-Shyan Lin, Cheng-Ying Ho | 2014-04-29 |
| 8709854 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2014-04-29 |
| 8664736 | Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same | Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Wen-De Wang, Yueh-Chiou Lin | 2014-03-04 |
| 8628990 | Image device and methods of forming the same | Cheng-Ta Wu, Sheng Chiao, Yeur-Luen Tu, Chia-Shiung Tsai | 2014-01-14 |
| 8435824 | Backside illumination sensor having a bonding pad structure and method of making the same | Dun-Nian Yaung, Jeng-Shyan Lin, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2013-05-07 |