Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9129953 | Method of making a gate structure | Da-Yuan Lee, Kuang-Yuan Hsu | 2015-09-08 |
| 9048334 | Metal gate structure | Da-Yuan Lee, Kuang-Yuan Hsu | 2015-06-02 |
| 8951841 | Clip frame semiconductor packages and methods of formation thereof | Melissa Mei Ching Ng, Mei Chin Ng | 2015-02-10 |
| 8779530 | Metal gate structure of a field effect transistor | Da-Yuan Lee, Kuang-Yuan Hsu | 2014-07-15 |
| 8736042 | Delamination resistant device package having raised bond surface and mold locking aperture | Felix C. Li, Yee Kim Lee, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2014-05-27 |
| 8716785 | Method and system for metal gate formation with wider metal gate fill margin | Meng-Hsuan Chan, Kuang-Yuan Hsu | 2014-05-06 |
| 8575727 | Gate structures | Chia-Pin Lin, Kuang-Yuan Hsu | 2013-11-05 |
| 8546885 | Metal gate electrode of a field effect transistor | Cheng-Hao Hou, Da-Yuan Lee, Xiong-Fei Yu, Chun-Yuan Chou, Fan-Yi Hsu +2 more | 2013-10-01 |
| 8441107 | Gate structures | Chia-Pin Lin, Kuang-Yuan Hsu | 2013-05-14 |
| 8278173 | Method of fabricating gate structures | Chia-Pin Lin, Kuang-Yuan Hsu | 2012-10-02 |
| 8258587 | Transistor performance with metal gate | Yuri Masuoka, Shyh-Horng Yang | 2012-09-04 |
| 8193081 | Method and system for metal gate formation with wider metal gate fill margin | Meng-Hsuan Chan, Kuang-Yuan Hsu | 2012-06-05 |
| 8114721 | Method of controlling gate thickness in forming FinFET devices | Shun Wu Lin, Matt Yeh, Ouyang Hui | 2012-02-14 |
| 8097934 | Delamination resistant device package having low moisture sensitivity | Felix C. Li, Yee Kim Lee, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2012-01-17 |
| 8030138 | Methods and systems of packaging integrated circuits | You Chye How, Shee Min Yeong, Sek Hoi Chong | 2011-10-04 |
| 7871915 | Method for forming metal gates in a gate last process | Yong-Tian Hou, Chien-Hao Chen, Chi-Chun Chen | 2011-01-18 |
| 7868433 | Low stress cavity package | Shee Min Yeong, You Chye How | 2011-01-11 |
| 7838980 | TO263 device package having low moisture sensitivity | Yee Kim Lee, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2010-11-23 |
| 7824990 | Multi-metal-oxide high-K gate dielectrics | Vincent S. Chang, Fong-Yu Yen, Jin Ying, Hun-Jan Tao | 2010-11-02 |
| 7763958 | Leadframe panel for power packages | Terh Kuen Yii, Sek Hoi Chong | 2010-07-27 |
| 7714418 | Leadframe panel | Terh Kuen Yii, Mohd Sabri Bin Mohamad Zin, Ken Pham | 2010-05-11 |
| 7582954 | Optical leadless leadframe package | Terh Kuen Yii, You Chye How, Sek Hoi Chong, Shee Min Yeong | 2009-09-01 |
| 7470978 | Sawn power package and method of fabricating same | Eng Hwa Tan, Santhiran Nadarajah | 2008-12-30 |
| 7465634 | Method of forming integrated circuit devices having n-MOSFET and p-MOSFET transistors with elevated and silicided source/drain structures | Yong-Tian Hou, Jin Ying, Hun-Jan Tao | 2008-12-16 |
| 7342297 | Sawn power package | Eng Hwa Tan, Santhiran Nadarajah | 2008-03-11 |