Issued Patents All Time
Showing 26–50 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272674 | Stacking structure, package structure and method of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2025-04-08 |
| 12272622 | Package and manufacturing method thereof | Sung-Feng Yeh, Jian-Wei Hong | 2025-04-08 |
| 12266637 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-04-01 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Hsien-Pin Hu, Chen-Hua Yu, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2025-04-01 |
| 12266584 | Integrated circuit package and method | Hsien-Wei Chen, Sung-Feng Yeh | 2025-04-01 |
| 12261163 | Molded dies in semiconductor packages and methods of forming same | Jie Chen, Hsien-Wei Chen | 2025-03-25 |
| 12255116 | Semiconductor structure and manufacturing method thereof | Ta Hao Sung, Sung-Feng Yeh | 2025-03-18 |
| 12249580 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ying-Ju Chen | 2025-03-11 |
| 12248178 | Packaged device including an optical path structure aligned to an optical feature | Hsien-Wei Chen | 2025-03-11 |
| 12243830 | Semiconductor devices and methods of manufacture | Hsien-Wei Chen | 2025-03-04 |
| 12237283 | Semiconductor structure and method for manufacturing the same | Hsien-Wei Chen | 2025-02-25 |
| 12223250 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Sen-Bor Jan, Meng-Wei Chiang | 2025-02-11 |
| 12224257 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2025-02-11 |
| 12224265 | Three-dimensional stacking structure and manufacturing method thereof | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2025-02-11 |
| 12218026 | Package structure for heat dissipation | Chen-Hua Yu, Sung-Feng Yeh | 2025-02-04 |
| 12218093 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2025-02-04 |
| 12218097 | Bonding to alignment marks with dummy alignment marks | Hsien-Wei Chen, Ying-Ju Chen | 2025-02-04 |
| 12218105 | Package and method of forming the same | Jie Chen, Hsien-Wei Chen | 2025-02-04 |
| 12218108 | Package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2025-02-04 |
| 12211707 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ying-Ju Chen | 2025-01-28 |
| 12211823 | Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang, Sung-Feng Yeh, Ying-Ju Chen | 2025-01-28 |
| 12210187 | Semiconductor structure | Hsien-Wei Chen | 2025-01-28 |
| 12205911 | Bonding structure and method of forming same | Sung-Feng Yeh, Hsien-Wei Chen, Jie Chen | 2025-01-21 |
| 12199024 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2025-01-14 |
| 12191283 | Manufacturing method of three-dimensional stacking structure | Hsien-Wei Chen, Jie Chen | 2025-01-07 |