Issued Patents All Time
Showing 51–75 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714383 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Chih-Yuan Ting, Minghsing Tsai | 2020-07-14 |
| 10672651 | Method for forming structure of dual damascene structures having via hole and trench | Tai-Yen Peng | 2020-06-02 |
| 10665467 | Spacer etching process for integrated circuit design | Ru-Gun Liu, Cheng-Hsiung Tsai, Chung-Ju Lee, Chih-Ming Lai, Chia-Ying Lee +6 more | 2020-05-26 |
| 10651047 | Double patterning method | Chia-Ying Lee | 2020-05-12 |
| 10651373 | Memory device and fabrication method thereof | Tai-Yen Peng, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang +3 more | 2020-05-12 |
| 10535556 | Integrated circuit with conductive line having line-ends | Chih-Yuan Ting, Pei-Wen Huang | 2020-01-14 |
| 10522391 | Method and apparatus for back end of line semiconductor device processing | Chung-Wen Wu, Chih-Yuan Ting | 2019-12-31 |
| 10515895 | Method of preventing pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen, Jang-Shiang Tsai | 2019-12-24 |
| 10510553 | Dry ashing by secondary excitation | Jack Kuo-Ping Kuo, Sheng-Liang Pan, Chia-Yang Hung, Shu-Huei Suen, Syun-Ming Jang | 2019-12-17 |
| 10504780 | Contact plug without seam hole and methods of forming the same | Chih-Yuan Ting | 2019-12-10 |
| 10354949 | Air gap structure and method | Chih-Yuan Ting | 2019-07-16 |
| 10290538 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Chih-Yuan Ting, Minghsing Tsai | 2019-05-14 |
| 10276376 | Multi-patterning method and device formed by the method | Chia-Ying Lee | 2019-04-30 |
| 10276794 | Memory device and fabrication method thereof | Tai-Yen Peng, Hui-Hsien Wei, Wei-Chih Wen, Pin-Ren Dai, Chien-Min Lee +2 more | 2019-04-30 |
| 10269632 | Semiconductor device and method | Ming-Hui Chu, Chih-Yuan Ting | 2019-04-23 |
| 10163689 | Integrated circuit with conductive line having line-ends | Chih-Yuan Ting, Pei-Wen Huang | 2018-12-25 |
| 10157775 | Method for manufacturing a semiconductor device | Chih-Hao Chen, Ming-Chung Liang, Shu-Huei Suen, Wen-Yen Chen | 2018-12-18 |
| 10109497 | Double patterning method | Chia-Ying Lee | 2018-10-23 |
| 10043754 | Semiconductor device having air gap structures and method of fabricating thereof | Chih-Yuan Ting | 2018-08-07 |
| 9991200 | Air gap structure and method | Chih-Yuan Ting | 2018-06-05 |
| 9966309 | Contact plug without seam hole and methods of forming the same | Chih-Yuan Ting | 2018-05-08 |
| 9929094 | Semiconductor device having air gap structures and method of fabricating thereof | Chih-Yuan Ting | 2018-03-27 |
| 9892960 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Chih-Yuan Ting, Minghsing Tsai | 2018-02-13 |
| 9887126 | Structure of dual damascene structures having via hole and trench | Tai-Yen Peng | 2018-02-06 |
| 9865500 | Method of fine line space resolution lithography for integrated circuit features using double patterning technology | Chia-Ying Lee | 2018-01-09 |