Issued Patents All Time
Showing 26–50 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676821 | Self-aligned double patterning | Kuan-Wei Huang, Yu-Yu Chen | 2023-06-13 |
| 11665971 | Metal etching stop layer in magnetic tunnel junction memory cells | Tai-Yen Peng, Sin-Yi Yang, Chen-Jung Wang, Yu-Shu Chen, Chien-Chung Huang +2 more | 2023-05-30 |
| 11588107 | Integrated circuit structure | Tai-Yen Peng, Hui-Hsien Wei, Wei-Chih Wen, Pin-Ren Dai, Chien-Min Lee +2 more | 2023-02-21 |
| 11482426 | Double patterning method | Chia-Ying Lee | 2022-10-25 |
| 11456210 | Integrated circuit and method for manufacturing the same | Kuan-Wei Huang, Yi-Nien Su, Yu-Yu Chen | 2022-09-27 |
| 11411176 | Gradient protection layer in MTJ manufacturing | Tai-Yen Peng, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang, Chien-Chung Huang +2 more | 2022-08-09 |
| 11404245 | DC bias in plasma process | Sheng-Liang Pan, Bing Chen, Chia-Yang Hung, Shu-Huei Suen, Syun-Ming Jang +1 more | 2022-08-02 |
| 11398405 | Method and apparatus for back end of line semiconductor device processing | Chung-Wen Wu, Chih-Yuan Ting | 2022-07-26 |
| 11322393 | Method of forming a semiconductor device | Yi-Nien Su, Shu-Huei Suen, Ru-Gun Liu | 2022-05-03 |
| 11271150 | Integrated circuit | Tai-Yen Peng, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang +3 more | 2022-03-08 |
| 11217476 | Method of forming an interconnect structure of a semiconductor device | Tai-Yen Peng | 2022-01-04 |
| 11177138 | Double patterning method | Chia-Ying Lee | 2021-11-16 |
| 11127630 | Contact plug without seam hole and methods of forming the same | Chih-Yuan Ting | 2021-09-21 |
| 11101429 | Metal etching stop layer in magnetic tunnel junction memory cells | Tai-Yen Peng, Sin-Yi Yang, Chen-Jung Wang, Yu-Shu Chen, Chien-Chung Huang +2 more | 2021-08-24 |
| 11063217 | Semiconductor device | Tai-Yen Peng, Hui-Hsien Wei, Wei-Chih Wen, Pin-Ren Dai, Chien-Min Lee +2 more | 2021-07-13 |
| 11043453 | Method of preventing pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen, Jang-Shiang Tsai | 2021-06-22 |
| 11037981 | Semiconductor device with magnetic tunnel junctions | Tai-Yen Peng, Tsung-Hsien Chang, Yu-Shu Chen, Chih-Yuan Ting, Chung-Te Lin | 2021-06-15 |
| 10985054 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Chih-Yuan Ting, Minghsing Tsai | 2021-04-20 |
| 10868239 | Gradient protection layer in MTJ manufacturing | Tai-Yen Peng, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang, Chien-Chung Huang +2 more | 2020-12-15 |
| 10867840 | Method of forming a semiconductor device | Yi-Nien Su, Shu-Huei Suen, Ru-Gun Liu | 2020-12-15 |
| 10862023 | Semiconductor structure and manufacturing method of the same | Tai-Yen Peng, Yu-Shu Chen, Chien-Chung Huang, Sin-Yi Yang, Chen-Jung Wang +2 more | 2020-12-08 |
| 10770345 | Integrated circuit and fabrication method thereof | Tai-Yen Peng, Chang-Sheng Lin, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang +3 more | 2020-09-08 |
| 10755974 | Interconnect structure and method of forming same | Ming-Hui Chu, Chih-Yuan Ting | 2020-08-25 |
| 10755945 | Metal contacts on metal gates and methods thereof | Pang-Sheng Chang, Yu-Feng Yin, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang +9 more | 2020-08-25 |
| 10734580 | Memory device and fabrication method thereof | Tai-Yen Peng, Hui-Hsien Wei, Wei-Chih Wen, Pin-Ren Dai, Chien-Min Lee +2 more | 2020-08-04 |