Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510586 | Multi-layer structure having a dense middle layer | Chin Kun Lan | 2019-12-17 |
| 10181443 | Support structure for barrier layer of semiconductor device | Keng-Chu Lin | 2019-01-15 |
| 10134632 | Low-K dielectric layer and porogen | Hui-Chun Yang, Yu-Yun Peng, Keng-Chu Lin | 2018-11-20 |
| 10008367 | Gas diffuser unit, process chamber and wafer processing method | Chien-Kuo Huang, Shih-Wen Huang, Chia-I Shen, Fei-Fan Chen | 2018-06-26 |
| 9941214 | Semiconductor devices, methods of manufacture thereof, and inter-metal dielectric (IMD) structures | Yu-Yun Peng, Keng-Chu Lin, Kuang-Yuan Hsu | 2018-04-10 |
| 9870944 | Back-end-of-line (BEOL) interconnect structure | Keng-Chu Lin | 2018-01-16 |
| 9812390 | Semiconductor devices including conductive features with capping layers and methods of forming the same | Hui-Chun Yang, Mei-Ling Chen, Keng-Chu Lin | 2017-11-07 |
| 9748175 | Conductive structure in semiconductor structure and method for forming the same | Yi-Jung Liu, Huan-Wei Wu, Chester Tang | 2017-08-29 |
| 9748134 | Method of making interconnect structure | Po-Cheng Shih, Yu-Yun Peng, Chia-Cheng Chou | 2017-08-29 |
| 9564383 | Low-K dielectric layer and porogen | Hui-Chun Yang, Yu-Yun Peng, Keng-Chu Lin | 2017-02-07 |
| 9379061 | High density dielectric etch-stop layer | Han-Ti Hsiaw, Keng-Chu Lin | 2016-06-28 |
| 9373581 | Interconnect structure and method for forming the same | Po-Cheng Shih, Chih-Hung Sun, Chia-Cheng Chou, Kuang-Yuan Hsu | 2016-06-21 |
| 9349689 | Semiconductor devices including conductive features with capping layers and methods of forming the same | Hui-Chun Yang, Mei-Ling Chen, Keng-Chu Lin | 2016-05-24 |
| 9341945 | Photoresist and method of formation and use | Keng-Chu Lin, Cheng-Han Wu, Ya Hui Chang | 2016-05-17 |
| 9269614 | Method of forming semiconductor device using remote plasma treatment | Po-Cheng Shih, Hui-Chun Yang, Chih-Hung Sun | 2016-02-23 |
| 9257331 | Method of making interconnect structure | Po-Cheng Shih, Yu-Yun Peng, Chia-Cheng Chou | 2016-02-09 |
| 9236294 | Method for forming semiconductor device structure | Chia-Cheng Chou, Chung-Chi Ko, Po-Cheng Shih, Chih-Hung Sun, Kuang-Yuan Hsu +1 more | 2016-01-12 |
| 9177918 | Apparatus and methods for low k dielectric layers | Yu-Yun Peng, Keng-Chu Lin, Hui-Chun Yang | 2015-11-03 |
| 9130022 | Method of back-end-of-line (BEOL) fabrication, and devices formed by the method | Shiauhan Wu, Han-Ti Hsiaw | 2015-09-08 |
| 9093455 | Back-end-of-line (BEOL) interconnect structure | Keng-Chu Lin | 2015-07-28 |
| 9076845 | Method of forming a high density dielectric etch-stop layer | Han-Ti Hsiaw, Keng-Chu Lin | 2015-07-07 |
| 9059259 | Hard mask for back-end-of-line (BEOL) interconnect structure | Han-Ti Hsiaw, Keng-Chu Lin | 2015-06-16 |
| 9054110 | Low-K dielectric layer and porogen | Hui-Chun Yang, Yu-Yun Peng, Keng-Chu Lin | 2015-06-09 |
| 9004914 | Method of and apparatus for active energy assist baking | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Shwang-Ming Jeng, Mei-Ling Chen | 2015-04-14 |
| 8993442 | Interconnect structure and method for forming the same | Po-Cheng Shih, Chih-Hung Sun, Chia-Cheng Chou, Kuang-Yuan Hsu | 2015-03-31 |