Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033955 | Electromagnetic shielding package structure comprising electroplating layer and package method thereof | MAN BAO, Zhen Gong | 2024-07-09 |
| 11951571 | Method of forming package structure | Cheng-Fu YU, Kai-Jih SHIH | 2024-04-09 |
| 11612965 | Method of forming package structure | Cheng-Fu YU, Kai-Jih SHIH | 2023-03-28 |
| 9748175 | Conductive structure in semiconductor structure and method for forming the same | Huan-Wei Wu, Chester Tang, Joung-Wei Liou | 2017-08-29 |
| 9282631 | Circuit with flat electromagnetic band gap resonance structure | Po-Wei Chiu, Ling-Chih Chou | 2016-03-08 |