Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11951571 | Method of forming package structure | Kai-Jih SHIH, Yi-Jung Liu | 2024-04-09 |
| 11612965 | Method of forming package structure | Kai-Jih SHIH, Yi-Jung Liu | 2023-03-28 |
| 8603643 | Electronic component having tin rich deposit layer and the process for depositing the same | Chia-Chun Chen, Pascal Oberndorff, Ker-Chang Hsieh | 2013-12-10 |