Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8603643 | Electronic component having tin rich deposit layer and the process for depositing the same | Cheng-Fu YU, Chia-Chun Chen, Pascal Oberndorff | 2013-12-10 |
| 8222731 | Cut-out heat slug for integrated circuit device packaging | Chia-Chun Chen, Kuo-Wen Peng | 2012-07-17 |
| 7656029 | Cut-out heat slug for integrated circuit device packaging | Chia-Chun Chen, Kuo-Wen Peng | 2010-02-02 |
| 7368023 | Zirconium-rich bulk metallic glass alloys | Y. Austin Chang, Hongbo Cao, Dong Hwan Ma, Ling Ding | 2008-05-06 |