Issued Patents All Time
Showing 176–200 of 414 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627537 | FinFET device and method of forming the same | Che-Cheng Chang, Chih-Han Lin | 2017-04-18 |
| 9627379 | FinFET devices and methods of forming the same | Che-Cheng Chang, Chih-Han Lin | 2017-04-18 |
| 9620610 | FinFET gate structure and method for fabricating the same | Shiu-Ko JangJian, Chi-Cheng Hung, Chi-Wen Liu | 2017-04-11 |
| 9602659 | Portable device with communication record recurring module | Kuo-Ching CHIANG | 2017-03-21 |
| 9601492 | FinFET devices and methods of forming the same | Jie Deng, Yi-Jen Chen | 2017-03-21 |
| 9576908 | Interconnection structure, fabricating method thereof, and semiconductor device using the same | Yu-Hung Lin, Chi-Wen Liu | 2017-02-21 |
| 9570567 | Source and drain process for FinFET | Che-Cheng Chang, Chih-Han Lin | 2017-02-14 |
| 9570493 | Dielectric grid bottom profile for light focusing | Yun-Wei Cheng, Chao-Hsiung Wang, Chun-Hao Chou, Tsung-Han Tsai, Kuo-Cheng Lee +1 more | 2017-02-14 |
| 9530887 | Fin-type field effect transistor device and manufacturing method thereof | Che-Cheng Chang, Chih-Han Lin | 2016-12-27 |
| 9461044 | Fin field effect transistor, semiconductor device and fabricating method thereof | Che-Cheng Chang, Chih-Han Lin | 2016-10-04 |
| 9368394 | Dry etching gas and method of manufacturing semiconductor device | Yu-Li Hung, Te-Ming Kung, Chih-Hao Chen, Kei-Wei Chen, Ying-Lang Wang +1 more | 2016-06-14 |
| 8822331 | Anchored damascene structures | David Lu, Syun-Ming Jang | 2014-09-02 |
| 8368220 | Anchored damascene structures | David Lu, Syun-Ming Jang | 2013-02-05 |
| 8034711 | Bonding structure and fabrication thereof | Chen-Hua Yu | 2011-10-11 |
| 7652378 | Aluminum-based interconnection in bond pad layer | Chenming Hu | 2010-01-26 |
| 7625806 | Method of fabricating a non-floating body device with enhanced performance | Jhy-Chyum Guo, Chenming Hu, Da-Chi Lin | 2009-12-01 |
| 7545662 | Method and system for magnetic shielding in semiconductor integrated circuit | Chao-Hsiung Wang, Denny Tang, Wen-Chin Lin, Mark Hsieh | 2009-06-09 |
| 7514730 | Method of fabricating a non-floating body device with enhanced performance | Jhy-Chyum Guo, Chenming Hu, Da-Chi Lin | 2009-04-07 |
| 7462561 | Contact structure formed using supercritical cleaning fluid and ALCVD | David Lu, Syun-Ming Jang | 2008-12-09 |
| 7452805 | Aluminum based conductor for via fill and interconnect | Chao-Hsiung Wang, Chien-Chao Huang, Chenming Hu | 2008-11-18 |
| 7413991 | Damascene process at semiconductor substrate level | — | 2008-08-19 |
| 7319262 | MRAM over sloped pillar | Chi-Wen Liu, Kuo-Ching CHIANG, Denny Tang | 2008-01-15 |
| 7265447 | Interconnect with composite layers and method for fabricating the same | Chen-Hua Yu, Syun-Ming Jang, Chenming Hu | 2007-09-04 |
| 7265038 | Method for forming a multi-layer seed layer for improved Cu ECP | Ping-Kun Wu, Chine-Gie Lo, Chao-Hsiung Wang, Shau-Lin Shue | 2007-09-04 |
| 7224427 | Megasonic immersion lithography exposure apparatus and method | Ching-Yu Chang, Chien-Hung Lin, Chin-Hsiang Lin, David Lu, Burn Jeng Lin | 2007-05-29 |