Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7265038 | Method for forming a multi-layer seed layer for improved Cu ECP | Ping-Kun Wu, Horng-Huei Tseng, Chao-Hsiung Wang, Shau-Lin Shue | 2007-09-04 |
CL
Chine-Gie Lo
Overall (All Time): #3,395,156 of 4,157,543Top 85%
1
Patents All Time