Issued Patents All Time
Showing 25 most recent of 392 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408411 | Semiconductor device | Chang-Yin Chen, Chih-Han Lin | 2025-09-02 |
| 12389669 | Enlarging spacer thickness by forming a dielectric layer over a recessed interlayer dielectric | Chih-Han Lin, Horng-Huei Tseng | 2025-08-12 |
| 12328897 | Structure and formation method of semiconductor device structure | Chih-Han Lin | 2025-06-10 |
| 12283526 | Edge fin trim process | Jen-Chun Chou, Ren-Yu Chang, Chen-Hsiang Lu | 2025-04-22 |
| 12278233 | Semiconductor device and manufacturing method thereof | Chih-Han Lin | 2025-04-15 |
| 12272595 | Removing polymer through treatment | Hung-Hao Chen, Wen-Tung Chen, Yu-Cheng Liu, Horng-Huei Tseng | 2025-04-08 |
| 12261051 | Semiconductor device with fin isolation | Chang-Yin Chen, Chih-Han Lin | 2025-03-25 |
| 12237417 | FinFET device and method of forming and monitoring quality of the same | Chang-Yin Chen, Chih-Han Lin, Horng-Huei Tseng | 2025-02-25 |
| 12211842 | Method for manufacturing FinFETs by fin-recessing processes to form v-shaped concaves and rounded concaves into gate stacks | Chih-Han Lin, Horng-Huei Tseng | 2025-01-28 |
| 12211750 | Mechanisms for forming FinFET device | Chang-Yin Chen, Jr-Jung Lin, Chih-Han Lin, Yung-Jung Chang | 2025-01-28 |
| 12176424 | FinFET device comprising plurality of dummy protruding features | Po-Chi Wu, Chih-Han Lin, Horng-Huei Tseng | 2024-12-24 |
| 12166040 | Integrated circuit and manufacturing method thereof | Chih-Han Lin, Horng-Huei Tseng | 2024-12-10 |
| 12125751 | Method and structure for FinFET isolation | Chih-Han Lin, Jr-Jung Lin | 2024-10-22 |
| 12080770 | Semiconductor device and method | Chih-Han Lin, Horng-Huei Tseng | 2024-09-03 |
| 12057343 | FinFET devices with embedded air gaps and the fabrication thereof | Chih-Han Lin | 2024-08-06 |
| 12051752 | Embedded source or drain region of transistor with downward tapered region under facet region | Tung-Wen Cheng, Zhe Zhang, Yung-Jung Chang | 2024-07-30 |
| 12033891 | Method of forming trenches | Chih-Han Lin | 2024-07-09 |
| 11973144 | Method of manufacturing a semiconductor and a semiconductor device | Chang-Yin Chen, Chih-Han Lin | 2024-04-30 |
| 11948835 | Interconnection structure with anti-adhesion layer | Chih-Han Lin | 2024-04-02 |
| 11935889 | Fin structure and method of forming same through two-step etching processes | Chih-Han Lin, Horng-Huei Tseng | 2024-03-19 |
| 11929419 | Semiconductor device | Chang-Yin Chen, Chih-Han Lin | 2024-03-12 |
| 11854883 | Interconnect structure and method for forming the same | Chih-Han Lin | 2023-12-26 |
| 11855217 | Semiconductor device having a conductive contact in direct contact with an upper surface and a sidewall of a gate metal layer | Chih-Han Lin, Horng-Huei Tseng | 2023-12-26 |
| 11854962 | Via structure and methods thereof | Chih-Han Lin | 2023-12-26 |
| 11842932 | Notched gate structure fabrication | Chang-Yin Chen, Chih-Han Lin | 2023-12-12 |