Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748798 | Wireless camera wafer for vacuum chamber diagnostics | Tzu-Chung Tsai, Chii-Ming Wu | 2020-08-18 |
| 10658581 | Semiconductor device structure with multiple resistance variable layers | Hsing-Lien Lin, Chii-Ming Wu, Cheng-Yuan Tsai | 2020-05-19 |
| 10622555 | Film scheme to improve peeling in chalcogenide based PCRAM | Chin-Wei Liang, Hsing-Lien Lin, Fa-Shen Jiang | 2020-04-14 |
| 10505107 | Switching layer scheme to enhance RRAM performance | Cheng-Yuan Tsai, Hsing-Lien Lin, Wen-Ting Chu | 2019-12-10 |
| 10497867 | Multi-layer structure to increase crystalline temperature of a selector device | — | 2019-12-03 |
| 10176866 | Recap layer scheme to enhance RRAM performance | Hsing-Lien Lin, Hsia-Wei Chen | 2019-01-08 |
| 10164003 | MIM capacitor and method of forming the same | Hsing-Lien Lin, Cheng-Yuan Tsai | 2018-12-25 |
| 10164182 | Switching layer scheme to enhance RRAM performance | Cheng-Yuan Tsai, Hsing-Lien Lin, Wen-Ting Chu | 2018-12-25 |
| 10163949 | Image device having multi-layered refractive layer on back surface | Chih-Yu Lai, Min-Ying Tsai, Yeur-Luen Tu, Cheng-Yuan Tsai | 2018-12-25 |
| 10115896 | Semiconductor device and method of manufacturing the same | Yao-Wen Chang, Cheng-Yuan Tsai, Chin-Wei Liang, Yen-Chang Chu | 2018-10-30 |
| 9978938 | Resistive RAM structure and method of fabrication thereof | Cheng-Yuan Tsai, Hsing-Lien Lin | 2018-05-22 |
| 9954166 | Embedded memory device with a composite top electrode | Hsing-Lien Lin, Yao-Wen Chang | 2018-04-24 |
| 9728597 | Metal-insulator-metal structure and method for forming the same | Hsing-Lien Lin, Chia-Shiung Tsai, Cheng-Yuan Tsai, Huey-Chi Chu, Wen-Chuan Chiang +1 more | 2017-08-08 |
| 9647207 | Resistive random access memory (RRAM) structure | Chia-Shiung Tsai, Chin-Wei Liang, Cheng-Yuan Tsai, Hsing-Lien Lin, Chin-Chieh Yang +1 more | 2017-05-09 |
| 9627613 | Resistive random access memory (RRAM) cell with a composite capping layer | Cheng-Yuan Tsai, Hsing-Lien Lin | 2017-04-18 |