Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10050033 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Hsiao-Chin Tuan, Yi-Huan Chen, Alexander Kalnitsky +1 more | 2018-08-14 |
| 9853149 | Floating grid and crown-shaping poly for improving ILD CMP dishing | Chao-Hsuing Chen, Yi-Huan Chen, Kong-Beng Thei, Ker Hsiao Huo, Szu-Hsien Liu | 2017-12-26 |
| 9111957 | Coupling well structure for improving HVMOS performance | Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang | 2015-08-18 |
| 8592923 | Coupling well structure for improving HVMOS performance | Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang | 2013-11-26 |
| 8049295 | Coupling well structure for improving HVMOS performance | Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang | 2011-11-01 |
| 7816214 | Coupling well structure for improving HVMOS performance | Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang | 2010-10-19 |
| 7816169 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2010-10-19 |
| 7485906 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2009-02-03 |
| 7323784 | Top via pattern for bond pad structure | Ho-Yin Yiu, Yu-Jui Wu, Aaron Wang, Hsiang-Wei Wang, Huang-Sheng Lin +2 more | 2008-01-29 |
| 7183598 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2007-02-27 |
| 6958546 | Method for dual-layer polyimide processing on bumping technology | Cheng-Yu Chu, Kuo-Wei Lin, Shih-Jang Lin, Yang-Tung Fran, Chiou-Shian Peng | 2005-10-25 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Chiou-Shian Peng +1 more | 2005-08-30 |
| 6876049 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2005-04-05 |
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Cheng-Yu Chu, Kuo-Wei Lin, Chiou-Shian Peng, Yang-Tung Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Cheng-Yu Chu, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2003-08-12 |
| 6586323 | Method for dual-layer polyimide processing on bumping technology | Cheng-Yu Chu, Kuo-Wei Lin, Shih-Jang Lin, Yang-Tung Fan, Chiou-Shian Peng | 2003-07-01 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Shih-Jane Lin +2 more | 2003-06-24 |
| 6482669 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2002-11-19 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Kuo-Wei Lin, Yen-Ming Chen, Cheng-Yu Chu, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2002-04-16 |