Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-08-23 |
| 11374136 | Semiconductor package and forming method thereof | Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu +2 more | 2022-06-28 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-05-03 |
| 11309225 | Fan-out package structure and method of manufacturing the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2022-04-19 |
| 11251141 | Package structure | Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2022-02-15 |
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Ting-Ting Kuo, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2021-10-26 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2021-06-29 |
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2021-05-18 |
| 11004786 | Package structure and method of forming the same | Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2021-05-11 |
| 10878073 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2020-12-29 |
| 10861841 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu +2 more | 2020-12-08 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2020-11-10 |
| 10762319 | Fingerprint sensor and manufacturing method thereof | Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2020-09-01 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2020-06-30 |
| 10672729 | Package structure and method of forming package structure | Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2020-05-19 |
| 10510631 | Fan out package structure and method of manufacturing the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2019-12-17 |
| 10157808 | Package structure and method of forming package structure | Ting-Ting Kuo, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2018-12-18 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-12-18 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-27 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Hao-Yi Tsai, Yu-Feng Chen +1 more | 2017-06-27 |