Issued Patents All Time
Showing 76–100 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7846833 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Hideki Kitada, Nobuyuki Ohtsuka, Yoshiyuki Nakao | 2010-12-07 |
| 7816279 | Semiconductor device and method for manufacturing the same | Michie Sunayama, Yoshiyuki Nakao | 2010-10-19 |
| 7803642 | Evaluation method of semiconductor device | Michie Sunayama, Masaki Haneda | 2010-09-28 |
| 7795141 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Nobuyuki Ohtsuka, Hideki Kitada, Yoshiyuki Nakano | 2010-09-14 |
| 7713869 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Hideki Kitada, Nobuyuki Ohtsuka, Yoshiyuki Nakao | 2010-05-11 |
| 7536780 | Method of manufacturing wiring substrate to which semiconductor chip is mounted | Tomoo Yamasaki, Kiyoshi Oi, Akio Rokugawa | 2009-05-26 |
| 7507666 | Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition | Yoshiyuki Nakao, Hideki Kitada, Nobuyuki Ohtsuka | 2009-03-24 |
| 7507659 | Fabrication process of a semiconductor device | Nobuyuki Ohtsuka, Yoshiyuki Nakao | 2009-03-24 |
| 7413977 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Nobuyuki Ohtsuka, Hideki Kitada, Yoshiyuki Nakao | 2008-08-19 |
| 7414309 | Encapsulated electronic part packaging structure | Kiyoshi Oi, Yasuyoshi Horikawa | 2008-08-19 |
| 7403370 | Capacitor parts | Kiyoshi Oi, Tomoo Yamasaki | 2008-07-22 |
| 7381643 | Wiring structure forming method and semiconductor device | Hisaya Sakai | 2008-06-03 |
| 7375022 | Method of manufacturing wiring board | Kiyoshi Oi, Tomoo Yamasaki | 2008-05-20 |
| 7358180 | Method of forming wiring structure and semiconductor device | Hisaya Sakai | 2008-04-15 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate | Tomoo Yamasaki, Akio Rokugawa, Takahiro Iijima | 2008-04-01 |
| 7329952 | Method of fabricating a semiconductor device | Hideki Kitada | 2008-02-12 |
| 7314780 | Semiconductor package, method of production of same, and semiconductor device | Akio Rokugawa, Takahiro Iijima | 2008-01-01 |
| 7304384 | Semiconductor device with a barrier film which contains manganese | Junichi Koike, Makoto Wada, Shingo Takahashi, Hideki Shibata, Satoshi Nishikawa +3 more | 2007-12-04 |
| 7284307 | Method for manufacturing wiring board | Tomoo Yamasaki, Kiyoshi Oi | 2007-10-23 |
| 7279790 | Semiconductor device and a manufacturing method thereof | Hideki Kitada, Nobuyuki Ohtsuka, Takayuki Ohba | 2007-10-09 |
| 7229856 | Method of manufacturing electronic part packaging structure | Kiyoshi Oi, Yasuyoshi Horikawa | 2007-06-12 |
| 7211519 | Method for manufacturing semiconductor device | Yukio Takigawa, Toshiya Suzuki, Hajime Kawabe | 2007-05-01 |
| 7173337 | Semiconductor device manufactured by the damascene process having improved stress migration resistance | Kenichi Watanabe, Takashi Suzuki | 2007-02-06 |
| 7067919 | Semiconductor device | Kenichi Watanabe, Takashi Suzuki | 2006-06-27 |
| 7042093 | Semiconductor device using metal nitride as insulating film | Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki, Nobuyuki Nishikawa | 2006-05-09 |