Issued Patents All Time
Showing 51–75 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8823187 | Semiconductor package, semiconductor package manufacturing method and semiconductor device | Akio Rokugawa, Osamu Inoue | 2014-09-02 |
| 8785256 | Method of manufacturing semiconductor package | Akio Rokugawa | 2014-07-22 |
| 8724978 | Fluid heating-cooling cylinder device | Yuji Furumura, Naomi Mura, Shinji Nishihara | 2014-05-13 |
| 8709939 | Semiconductor device having a multilevel interconnect structure and method for fabricating the same | Junichi Koike, Yoshito Fujii, Jun Iijima, Kazuyoshi Maekawa, Koji Arita +2 more | 2014-04-29 |
| 8581421 | Semiconductor package manufacturing method and semiconductor package | Akio Rokugawa, Hirokazu Yoshino | 2013-11-12 |
| 8551879 | Semiconductor device and method for manufacturing semiconductor device | Noboyuki Ohtsuka | 2013-10-08 |
| 8497208 | Semiconductor device and method for manufacturing the same | Michie Sunayama, Yoshiyuki Nakao | 2013-07-30 |
| 8415798 | Semiconductor device having a conductor buried in an opening | Nobuyuki Ohtsuka | 2013-04-09 |
| 8378492 | Semiconductor package | Akio Rokugawa | 2013-02-19 |
| 8373274 | Method of forming wiring structure and semiconductor device comprising underlying refractory metal layers | Hisaya Sakai | 2013-02-12 |
| 8304908 | Semiconductor device having a multilevel interconnect structure and method for fabricating the same | Junichi Koike, Yoshito Fujii, Jun Iijima, Kazuyoshi Maekawa, Koji Arita +2 more | 2012-11-06 |
| 8288875 | Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch | Akio Rokugawa | 2012-10-16 |
| 8168532 | Method of manufacturing a multilayer interconnection structure in a semiconductor device | Masaki Haneda, Michie Sunayama, Nobuyuki Ohtsuka, Yoshiyuki Nakao, Takahiro Tabira | 2012-05-01 |
| 8133813 | Semiconductor device with a barrier film | Junichi Koike, Makoto Wada, Shingo Takahashi, Hideki Shibata, Satoshi Nishikawa +3 more | 2012-03-13 |
| 8119524 | Method of manufacturing semiconductor device | Michie Sunayama | 2012-02-21 |
| 8101513 | Manufacture method for semiconductor device using damascene method | Tsuyoshi Kanki, Nobuyuki Ohtsuka, Hisaya Sakai | 2012-01-24 |
| 8071474 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Nobuyuki Ohtsuka, Hideki Kitada, Yoshiyuki Nakao | 2011-12-06 |
| 8067309 | Semiconductor device using metal nitride as insulating film and its manufacture method | Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki, Nobuyuki Nishikawa | 2011-11-29 |
| 8067836 | Semiconductor device with reduced increase in copper film resistance | Masaki Haneda, Nobuyuki Ohtsuka, Yoshiyuki Nakao, Michie Sunayama, Takahiro Tabira | 2011-11-29 |
| 8003518 | Semiconductor device fabrication method | Masaki Haneda, Michie Sunayama | 2011-08-23 |
| 8003527 | Manufacturing method of semiconductor device | Michie Sunayama | 2011-08-23 |
| 7994055 | Method of manufacturing semiconductor apparatus, and semiconductor apparatus | Hisaya Sakai | 2011-08-09 |
| 7955970 | Semiconductor device manufacturing method | Michie Sunayama, Masaki Haneda | 2011-06-07 |
| 7943517 | Semiconductor device with a barrier film | Junichi Koike, Makoto Wada, Shingo Takahashi, Hideki Shibata, Satoshi Nishikawa +3 more | 2011-05-17 |
| 7935624 | Fabrication method of semiconductor device having a barrier layer containing Mn | Nobuyuki Ohtsuka, Yoshiyuki Nakao, Hisaya Sakai | 2011-05-03 |