Issued Patents All Time
Showing 101–112 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7038904 | Capacitor and method of producing same | Kiyoshi Ooi, Tomoo Yamasaki, Yasuyoshi Horikawa | 2006-05-02 |
| 6999299 | Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board | Tomoo Yamasaki, Kiyoshi Ooi, Akio Rokugawa | 2006-02-14 |
| 6992005 | Semiconductor device and method of manufacturing the same | Nobuyuki Ohtsuka, Hisaya Sakai, Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki | 2006-01-31 |
| 6921977 | Semiconductor package, method of production of same, and semiconductor device | Akio Rokugawa, Takahiro Iijima | 2005-07-26 |
| 6900542 | Semiconductor device having increased adhesion between a barrier layer for preventing copper diffusion and a conductive layer, and method of manufacturing the same | Hisaya Sakai, Nobuyuki Ohtsuka | 2005-05-31 |
| 6884655 | Semiconductor package, method of manufacturing the same, and semiconductor device | Takahiro Iljima, Akio Rokugawa | 2005-04-26 |
| 6828224 | Method of fabricating substrate utilizing an electrophoretic deposition process | Takahiro Iijima, Akio Rokugawa | 2004-12-07 |
| 6764931 | Semiconductor package, method of manufacturing the same, and semiconductor device | Takahiro Iijima, Akio Rokugawa | 2004-07-20 |
| 6750541 | Semiconductor device | Nobuyuki Ohtsuka, Hisaya Sakai, Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki | 2004-06-15 |
| 6746957 | Manufacture of semiconductor device with copper wiring | Nobuyuki Ohtsuka | 2004-06-08 |
| 6242808 | Semiconductor device with copper wiring and semiconductor device manufacturing method | Hideki Kitada, Nobuyuki Ohtsuka | 2001-06-05 |
| 5478400 | Apparatus for fabricating semiconductor devices | — | 1995-12-26 |