Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8567384 | Slicing method and wire saw apparatus | Hiroshi Oishi, Koji Kitagawa | 2013-10-29 |
| 8492879 | Semiconductor substrate and semiconductor device | Tadahiro Ohmi, Akinobu Teramoto, Tomoyuki Suwa, Rihito Kuroda, Yoshinori Hayamizu | 2013-07-23 |
| 8454410 | Polishing apparatus | Koji Kitagawa, Junichi Ueno, Syuichi Kobayashi, Tadakazu Miyashita, Atsushi Kajikura +1 more | 2013-06-04 |
| 8318275 | Multi-color molding article, multicolor molding method and substrate storage container | Hiroki Yamagishi | 2012-11-27 |
| 8118646 | Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method | Kazuya Sato, Junichi Ueno, Syuichi Kobayashi | 2012-02-21 |
| 7017749 | Precision substrate storage container and retaining member therefor | Toshitsugu Yajima, Masato Hosoi, Takashi Matsuo | 2006-03-28 |
| 6951340 | Gaskets for substrate containers | Tsutomu Suzuki, Chiho Seki, Takashi Matsuo | 2005-10-04 |
| 6841218 | Write once optical recording medium | Yasuo Hosoda, Satoshi Jinno, Ayumi Mitsumori | 2005-01-11 |
| 6828000 | Optical recording medium | Yasuo Hosoda, Satoshi Jinno, Ayumi Mitsumori | 2004-12-07 |
| 6432837 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Takashi Nihonmatsu, Seiichi Miyazaki, Masahiko Yoshida, Tadahiro Kato | 2002-08-13 |
| 6402594 | Polishing method for wafer and holding plate | Daisuke Kobayashi, Tsuyoshi Matsuzaki | 2002-06-11 |
| 6346485 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Takashi Nihonmatsu, Seiichi Miyazaki, Masahiko Yoshida, Tadahiro Kato | 2002-02-12 |
| 6239039 | Semiconductor wafers processing method and semiconductor wafers produced by the same | Takashi Nihonmatsu, Seiichi Miyazaki, Masahiko Yoshida, Tadahiro Kato | 2001-05-29 |
| 6110839 | Method of purifying alkaline solution and method of etching semiconductor wafers | Masami Nakano, Isao Uchiyama, Toshio Ajito | 2000-08-29 |
| 6077149 | Method and apparatus for surface-grinding of workpiece | Sadayuki Ohkuni, Tadahiro Kato | 2000-06-20 |
| 6050880 | Surface grinding device and method of surface grinding a thin-plate workpiece | Tadahiro Kato, Sadayuki Okuni, Hiroshi Tomioka | 2000-04-18 |
| 5951374 | Method of polishing semiconductor wafers | Tadahiro Kato, Hisashi Masumura, Masami Nakano | 1999-09-14 |
| 5942445 | Method of manufacturing semiconductor wafers | Tadahiro Kato, Hisashi Masumura, Sadayuki Okuni | 1999-08-24 |
| 5914053 | Apparatus and method for double-sided polishing semiconductor wafers | Hisashi Masumura, Kiyoshi Suzuki | 1999-06-22 |
| 5891353 | Polishing agent used for polishing semiconductor wafers and polishing method using the same | Hisashi Masumura, Kiyoshi Suzuki, Teruaki Fukami | 1999-04-06 |
| 5866226 | Polishing agent used for polishing semiconductor wafers and polishing method using the same | Hisashi Masumura, Kiyoshi Suzuki, Teruaki Fukami | 1999-02-02 |
| 5827779 | Method of manufacturing semiconductor mirror wafers | Hisashi Masumura, Kiyoshi Suzuki | 1998-10-27 |
| 5827395 | Polishing pad used for polishing silicon wafers and polishing method using the same | Hisashi Masumura, Kiyoshi Suzuki | 1998-10-27 |
| 5821167 | Method of manufacturing semiconductor mirror wafers | Teruaki Fukami, Hisashi Masumura, Kiyoshi Suzuki | 1998-10-13 |
| 5800725 | Method of manufacturing semiconductor wafers | Tadahiro Kato, Hisashi Masumura | 1998-09-01 |