Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10011046 | Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece | — | 2018-07-03 |
| 10002753 | Chamfering apparatus and method for manufacturing notchless wafer | — | 2018-06-19 |
| 9358655 | Outer periphery polishing apparatus for disc-shaped workpiece | Akitoshi Enari, Mitsutaka Irago | 2016-06-07 |
| 8603897 | Method for manufacturing bonded wafer | — | 2013-12-10 |
| 8562390 | Double-disc grinding apparatus and method for producing wafer | Kenji Kobayashi | 2013-10-22 |
| 8454852 | Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon wafer | — | 2013-06-04 |
| 8231430 | Wafer production method | — | 2012-07-31 |
| 8037878 | Method for slicing workpiece by using wire saw and wire saw | Koji Kitagawa, Yukio Itoi, Tomiichi Sudou | 2011-10-18 |
| 8029339 | Workpiece double-disc grinding apparatus and workpiece double-disc grinding method | Kenji Kobayashi | 2011-10-04 |
| 7997262 | Method of improving nanotopography of surface of wafer and wire saw apparatus | Hiroshi Oishi | 2011-08-16 |
| 7507146 | Method for producing semiconductor wafer and semiconductor wafer | Masayoshi Sekizawa, Mamoru Okada, Hisashi Kijima | 2009-03-24 |
| 7332437 | Method for processing semiconductor wafer and semiconductor wafer | Takashi Nihonmatsu, Masahiko Yoshida, Yoshinori Sasaki, Masahito Saitoh, Toshiaki Takaku | 2008-02-19 |
| 6883342 | Multiform gas heat pump type air conditioning system | Tsukasa Kasagi | 2005-04-26 |
| 6787797 | Semiconductor wafer and device for semiconductor device manufacturing process | Kiyoshi Demizu, Shigeyoshi Netsu | 2004-09-07 |
| 6726525 | Method and device for grinding double sides of thin disk work | Shunichi Ikeda, Kenji Ohkura | 2004-04-27 |
| 6660337 | Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the same | Naoya Haruta, Takesi Tomiyama, Koichi Seike | 2003-12-09 |
| 6652358 | Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine | Shunichi Ikeda, Sadayuki Okuni | 2003-11-25 |
| 6491836 | Semiconductor wafer and production method therefor | Sadayuki Okuni, Shunichi Ikeda, Keiichi Okabe, Hisashi Oshima | 2002-12-10 |
| 6444317 | Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the same | Naoya Haruta, Takesi Tomiyama, Koichi Seike | 2002-09-03 |
| 6432837 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Takashi Nihonmatsu, Seiichi Miyazaki, Masahiko Yoshida, Hideo Kudo | 2002-08-13 |
| 6358117 | Processing method for a wafer | Hisashi Oshima, Keiichi Okabe | 2002-03-19 |
| 6346485 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Takashi Nihonmatsu, Seiichi Miyazaki, Masahiko Yoshida, Hideo Kudo | 2002-02-12 |
| 6284658 | Manufacturing process for semiconductor wafer | Sadayuki Okuni, Keiichi Okabe, Hisashi Oshima | 2001-09-04 |
| 6239039 | Semiconductor wafers processing method and semiconductor wafers produced by the same | Takashi Nihonmatsu, Seiichi Miyazaki, Masahiko Yoshida, Hideo Kudo | 2001-05-29 |
| 6220928 | Surface grinding method and apparatus for thin plate work | Keiichi Okabe, Hisashi Oshima, Sadayuki Okuni | 2001-04-24 |