Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11468165 | Intrusion prevention device, intrusion prevention method, and program | Hiroki Itoh | 2022-10-11 |
| 11176252 | Intrusion prevention device, intrusion prevention method, and intrusion prevention program | Takaaki Koyama, Jun Miyoshi, Yoshihiro Itoh, Naohiko Yoshizumi, Tetsuo Takahashi +3 more | 2021-11-16 |
| 9093498 | Method for manufacturing bonded wafer | Susumu Miyazaki | 2015-07-28 |
| D669533 | Electronic whiteboard | Toshihiro Nakashima, Atsushi Tani | 2012-10-23 |
| 7810383 | Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor wafer | Hisakazu Takano, Daisuke Nakamata | 2010-10-12 |
| 7727860 | Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer | Susumu Miyazaki, Tokio Takei | 2010-06-01 |
| D584355 | Electronic pen | Masataka Hidaka, Yukinobu Kudo | 2009-01-06 |
| 6583029 | Production method for silicon wafer and SOI wafer, and SOI wafer | Takao Abe, Tokio Takei, Hajime Miyajima | 2003-06-24 |
| 6491836 | Semiconductor wafer and production method therefor | Tadahiro Kato, Sadayuki Okuni, Shunichi Ikeda, Hisashi Oshima | 2002-12-10 |
| 6358117 | Processing method for a wafer | Tadahiro Kato, Hisashi Oshima | 2002-03-19 |
| 6284658 | Manufacturing process for semiconductor wafer | Tadahiro Kato, Sadayuki Okuni, Hisashi Oshima | 2001-09-04 |
| 6220928 | Surface grinding method and apparatus for thin plate work | Hisashi Oshima, Sadayuki Okuni, Tadahiro Kato | 2001-04-24 |