Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9662805 | Method of resuming operation of wire saw | Atsuo Uchiyama, Hisakazu Takano, Hitoshi Sejimo, Yukio Hijirisawa | 2017-05-30 |
| 8210906 | Slicing method and method for manufacturing epitaxial wafer | Hiroshi Oishi | 2012-07-03 |
| 8167681 | Slicing method | Hiroshi Oishi | 2012-05-01 |
| 7988530 | Slicing method | Hiroshi Oishi | 2011-08-02 |
| 7810383 | Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor wafer | Keiichi Okabe, Hisakazu Takano | 2010-10-12 |