Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350788 | Method for slicing workpiece and workpiece holder | Hisakazu Takano, Masahito Saitoh, Hirotoshi Kouzu | 2019-07-16 |
| 9662805 | Method of resuming operation of wire saw | Hisakazu Takano, Hitoshi Sejimo, Yukio Hijirisawa, Daisuke Nakamata | 2017-05-30 |
| 9163327 | Silicon wafer and a silicon epitaxial wafer having a polycrystal silicon layer formed on a major surface including boron concentration of the polycrystal silicon layer being 1×1015 atom/cm3 or less | Fumiaki Maruyama, Naoki Naito | 2015-10-20 |
| 8273146 | Wafer and epitaxial wafer, and manufacturing processes therefor | Fumiaki Maruyama, Naoki Naito | 2012-09-25 |
| 5395788 | Method of producing semiconductor substrate | Takao Abe, Yasuaki Nakazato | 1995-03-07 |
| 5266824 | SOI semiconductor substrate | Takao Abe, Yasuaki Nakazato | 1993-11-30 |
| 5213657 | Method for making uniform the thickness of a Si single crystal thin film | Takao Abe, Yasuaki Nakazato | 1993-05-25 |
| 5152857 | Method for preparing a substrate for semiconductor devices | Tatsuo Ito, Masao Fukami | 1992-10-06 |