Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12277348 | Memory system and information processing system | Takeshi Nakano, Akihiko ISHIHARA, Shingo Tanimoto, Shinji Maeda, Minoru Uchida +11 more | 2025-04-15 |
| 12271601 | Memory system having two or more write modes | Takashi Wakutsu, Takeshi Nakano | 2025-04-08 |
| 11853599 | Memory system and information processing system | Takeshi Nakano, Akihiko ISHIHARA, Shingo Tanimoto, Shinji Maeda, Minoru Uchida +11 more | 2023-12-26 |
| 5931147 | Method of cutting a workpiece with a wire saw | Noriaki Kubota, Hisakazu Takano, Mitsufumi Koyama | 1999-08-03 |
| 5800251 | Apparatus and method of lapping works | Kazuo Kubota, Hisakazu Takano | 1998-09-01 |
| 5554303 | Magnetic recording medium preparation | Hideo Kaneko, Katsushi Tokunaga, Yoshio Tawara, Noboru Tamai | 1996-09-10 |
| 5521781 | Substrate for magnetic recording medium | Hideo Kaneko, Toyofumi Aoki, Itsuo Kuroyanagi | 1996-05-28 |
| 5395788 | Method of producing semiconductor substrate | Takao Abe, Atsuo Uchiyama | 1995-03-07 |
| 5266824 | SOI semiconductor substrate | Takao Abe, Atsuo Uchiyama | 1993-11-30 |
| 5232870 | Method for production of bonded wafer | Tatsuo Ito | 1993-08-03 |
| 5223080 | Method for controlling thickness of single crystal thin-film layer in SOI substrate | Yutaka Ohta, Masatake Katayama, Takao Abe | 1993-06-29 |
| 5213657 | Method for making uniform the thickness of a Si single crystal thin film | Takao Abe, Atsuo Uchiyama | 1993-05-25 |
| 5191738 | Method of polishing semiconductor wafer | Hiroo Ogawara | 1993-03-09 |
| 5071785 | Method for preparing a substrate for forming semiconductor devices by bonding warped wafers | Tokio Takei | 1991-12-10 |
| 5032544 | Process for producing semiconductor device substrate using polishing guard | Tatsuo Ito | 1991-07-16 |
| 4388140 | Apparatus for wet treatment of wafer materials | Yasushi Miyazaki, Makoto Osuga, Masao Kodaira | 1983-06-14 |