Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7727860 | Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer | Susumu Miyazaki, Keiichi Okabe | 2010-06-01 |
| 6583029 | Production method for silicon wafer and SOI wafer, and SOI wafer | Takao Abe, Keiichi Okabe, Hajime Miyajima | 2003-06-24 |
| 6110391 | Method of manufacturing a bonding substrate | Susumu Nakamura, Kazushi Nakazawa | 2000-08-29 |
| 5938512 | Wafer holding jig | Susumu Nakamura | 1999-08-17 |
| 5340435 | Bonded wafer and method of manufacturing it | Yatsuo Ito, Takao Abe, Susumu Nakamura, Hiroko Ota | 1994-08-23 |
| 5071785 | Method for preparing a substrate for forming semiconductor devices by bonding warped wafers | Yasuaki Nakazato | 1991-12-10 |