Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350788 | Method for slicing workpiece and workpiece holder | Atsuo Uchiyama, Masahito Saitoh, Hirotoshi Kouzu | 2019-07-16 |
| 9662805 | Method of resuming operation of wire saw | Atsuo Uchiyama, Hitoshi Sejimo, Yukio Hijirisawa, Daisuke Nakamata | 2017-05-30 |
| 7810383 | Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor wafer | Keiichi Okabe, Daisuke Nakamata | 2010-10-12 |
| 5931147 | Method of cutting a workpiece with a wire saw | Yasuaki Nakazato, Noriaki Kubota, Mitsufumi Koyama | 1999-08-03 |
| 5800251 | Apparatus and method of lapping works | Yasuaki Nakazato, Kazuo Kubota | 1998-09-01 |