Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350788 | Method for slicing workpiece and workpiece holder | Atsuo Uchiyama, Hisakazu Takano, Hirotoshi Kouzu | 2019-07-16 |
| 7332437 | Method for processing semiconductor wafer and semiconductor wafer | Takashi Nihonmatsu, Masahiko Yoshida, Yoshinori Sasaki, Toshiaki Takaku, Tadahiro Kato | 2008-02-19 |