Issued Patents All Time
Showing 1–25 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172819 | Packaging bag and packaging body | Kazuyoshi Okada, Yoshikazu Kuwano, Tetsuhiro Kawano | 2024-12-24 |
| 11605716 | Nitride semiconductor substrate and method of manufacturing the same | Jun Komiyama, Yoshihisa Abe, Kenichi Eriguchi | 2023-03-14 |
| 11597033 | Laser processing head, laser processing device, and method for adjusting laser processing head | Takahiro Yagi, Ryosuke MITSUOKA | 2023-03-07 |
| 11155219 | Automobile door trim | — | 2021-10-26 |
| 10559679 | Nitride semiconductor epitaxial substrate | Noriko Omori, Yoshihisa Abe | 2020-02-11 |
| 10068858 | Compound semiconductor substrate | Yoshihisa Abe, Kenichi Eriguchi, Noriko Omori, Jun Komiyama | 2018-09-04 |
| 9748344 | Nitride semiconductor substrate having recesses at interface between base substrate and initial nitride | Noriko Omori, Yoshihisa Abe, Jun Komiyama, Kenichi Eriguchi, Tomoko Watanabe | 2017-08-29 |
| 9536955 | Nitride semiconductor substrate | Jun Komiyama, Kenichi Eriguchi, Akira Yoshida, Yoshihisa Abe, Shunichi Suzuki | 2017-01-03 |
| 9530846 | Nitride semiconductor substrate | Noriko Omori, Yoshihisa Abe, Jun Komiyama, Kenichi Eriguchi | 2016-12-27 |
| 9117743 | Nitride semiconductor substrate | Jun Komiyama, Akira Yoshida | 2015-08-25 |
| 9086321 | Method of analyzing nitride semiconductor layer and method of manufacturing nitride semiconductor substrate using the analysis method | Yoshihata Yanase, Hiroshi Shirai, Jun Komiyama | 2015-07-21 |
| 8986243 | Peritoneal dialysis patient connection system | Sobue Katsuyoshi, William R. Griswold, William W. Han, Andrew Steinhaus | 2015-03-24 |
| 8785942 | Nitride semiconductor substrate and method of manufacturing the same | Akira Yoshida, Jun Komiyama, Yoshihisa Abe, Kenichi Eriguchi, Shunichi Suzuki | 2014-07-22 |
| 8637960 | Nitride semiconductor substrate | Yoshihisa Abe, Jun Komiyama, Akira Yoshida, Kenichi Eriguchi, Shunichi Suzuki | 2014-01-28 |
| 8567384 | Slicing method and wire saw apparatus | Koji Kitagawa, Hideo Kudo | 2013-10-29 |
| 8406973 | Driving force control unit for vehicle | Toshio Masuda, Kenichi Yamamoto, Kenji Hijikata, Satoshi Satomura, Toyohide Sunaguchi +14 more | 2013-03-26 |
| 8210906 | Slicing method and method for manufacturing epitaxial wafer | Daisuke Nakamata | 2012-07-03 |
| 8212288 | Compound semiconductor substrate comprising a multilayer buffer layer | Jun Komiyama, Kenichi Eriguchi, Yoshihisa Abe, Akira Yoshida, Shunichi Suzuki | 2012-07-03 |
| 8167681 | Slicing method | Daisuke Nakamata | 2012-05-01 |
| 8148753 | Compound semiconductor substrate having multiple buffer layers | Jun Komiyama, Kenichi Eriguchi, Yoshihisa Abe, Akira Yoshida, Shunichi Suzuki | 2012-04-03 |
| 8108084 | Vehicle display device | Toshio Masuda, Kenichi Yamamoto, Kenji Hijikata, Satoshi Satomura, Toyohide Sunaguchi +14 more | 2012-01-31 |
| 8033845 | Rotary connector device | Tomohiro Sato | 2011-10-11 |
| 7997262 | Method of improving nanotopography of surface of wafer and wire saw apparatus | Tadahiro Kato | 2011-08-16 |
| 7988530 | Slicing method | Daisuke Nakamata | 2011-08-02 |
| 7887394 | Double-disc grinding machine, static pressure pad, and double-disc grinding method using the same for semiconductor wafer | Kenji Kobayashi | 2011-02-15 |