Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7179330 | Method of manufacturing silicon single crystal, silicon single crystal and silicon wafer | Izumi Fusegawa, Nobuaki Mitamura, Tomohiko Ohta, Nobuo Katuoka | 2007-02-20 |
| 6652358 | Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine | Shunichi Ikeda, Tadahiro Kato | 2003-11-25 |
| 6491836 | Semiconductor wafer and production method therefor | Tadahiro Kato, Shunichi Ikeda, Keiichi Okabe, Hisashi Oshima | 2002-12-10 |
| 6284658 | Manufacturing process for semiconductor wafer | Tadahiro Kato, Keiichi Okabe, Hisashi Oshima | 2001-09-04 |
| 6220928 | Surface grinding method and apparatus for thin plate work | Keiichi Okabe, Hisashi Oshima, Tadahiro Kato | 2001-04-24 |
| 6050880 | Surface grinding device and method of surface grinding a thin-plate workpiece | Tadahiro Kato, Hideo Kudo, Hiroshi Tomioka | 2000-04-18 |
| 5942445 | Method of manufacturing semiconductor wafers | Tadahiro Kato, Hisashi Masumura, Hideo Kudo | 1999-08-24 |