Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8287331 | Method for manufacturing polishing pad, and method for polishing wafer | Koichi Kanaya, Naotaka Toyama | 2012-10-16 |
| 7507146 | Method for producing semiconductor wafer and semiconductor wafer | Tadahiro Kato, Mamoru Okada, Hisashi Kijima | 2009-03-24 |