Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6077149 | Method and apparatus for surface-grinding of workpiece | Sadayuki Ohkuni, Hideo Kudo | 2000-06-20 |
| 6050880 | Surface grinding device and method of surface grinding a thin-plate workpiece | Sadayuki Okuni, Hideo Kudo, Hiroshi Tomioka | 2000-04-18 |
| 5951374 | Method of polishing semiconductor wafers | Hisashi Masumura, Masami Nakano, Hideo Kudo | 1999-09-14 |
| 5942445 | Method of manufacturing semiconductor wafers | Hisashi Masumura, Sadayuki Okuni, Hideo Kudo | 1999-08-24 |
| 5800725 | Method of manufacturing semiconductor wafers | Hisashi Masumura, Hideo Kudo | 1998-09-01 |
| 5679212 | Method for production of silicon wafer and apparatus therefor | Hideo Kudo | 1997-10-21 |
| 5494862 | Method of making semiconductor wafers | Masami Nakano, Sunao Shima, Hisashi Masumura | 1996-02-27 |
| 5474644 | Method and apparatus for high-flatness etching of wafer | Hideo Kudo | 1995-12-12 |
| 5447890 | Method for production of wafer | Sunao Shima, Masami Nakano, Hisashi Masumura, Hideo Kudo | 1995-09-05 |
| 4759961 | Coating method with crosslinked coatings from two coat-one bake systems | Yasuhiro Fujii, Hiroaki Kiyata, Masaru Mitsuzi, Mototaka Iihashi | 1988-07-26 |