YK

Yoshihiro Kubota

SC Shin-Etsu Chemical Co.: 103 patents #12 of 2,176Top 1%
Fujitsu Limited: 12 patents #2,592 of 24,456Top 15%
CU Cusic: 7 patents #2 of 3Top 70%
FL Fujitsu Semiconductor Limited: 4 patents #161 of 1,301Top 15%
TC Takagi Industrial Co.: 3 patents #4 of 29Top 15%
MC Mitsui Mining & Smelting Co.: 3 patents #195 of 838Top 25%
TO Toyota: 2 patents #10,861 of 26,838Top 45%
KL Kyushu Fujitsu Electronics Limited: 2 patents #26 of 75Top 35%
NU National University Corporation Tottori University: 2 patents #23 of 154Top 15%
TT The University Of Tokyo: 2 patents #500 of 2,633Top 20%
UC Unizeo Co.: 2 patents #6 of 13Top 50%
JI Japan Chemical Innovation Institute: 1 patents #25 of 43Top 60%
NT Ntt Advanced Technology: 1 patents #43 of 188Top 25%
GU Gifu University: 1 patents #31 of 107Top 30%
FC Furukawa Co.: 1 patents #36 of 90Top 40%
MC Mitsui Chemicals: 1 patents #1,270 of 2,279Top 60%
MC Murata Manufacturing Co.: 1 patents #3,462 of 5,295Top 70%
Overall (All Time): #7,756 of 4,157,543Top 1%
135
Patents All Time

Issued Patents All Time

Showing 76–100 of 135 patents

Patent #TitleCo-InventorsDate
7749870 Method for producing SOI substrate Makoto Kawai, Atsuo Ito, Kouichi Tanaka, Yuji Tobisaka, Shoji Akiyama +1 more 2010-07-06
7732867 Method for manufacturing SOQ substrate Shoji Akiyama, Atsuo Ito, Koichi Tanaka, Makoto Kawai, Yuuji Tobisaka 2010-06-08
7696059 Method for manufacturing semiconductor substrate Shoji Akiyama, Atsuo Ito, Makoto Kawai, Yuuji Tobisaka, Koichi Tanaka 2010-04-13
7693507 Wireless network control device and wireless network control system Hidehiko Suzuki, Tatsuhiro Ando, Takuji Oyama 2010-04-06
7691724 Method for manufacturing SOI substrate Makoto Kawai, Atsuo Ito, Koichi Tanaka, Yuuji Tobisaka, Shoji Akiyama 2010-04-06
7615456 Method for manufacturing SOI substrate Shoji Akiyama, Atsuo Ito, Makoto Kawai, Yuuji Tobisaka, Koichi Tanaka 2009-11-10
7476811 Semiconductor device and manufacturing method therefor Kazuto Tsuji, Sumikazu Hosoyamada 2009-01-13
7361980 Semiconductor device Sumikazu Hosoyamada, Kazuto Tsuji 2008-04-22
7122938 Surface acoustic wave device Hitoshi Noguchi 2006-10-17
7119042 Catalyst composition for the isomerization of n-paraffin and a process for isomerizing n-paraffin Yoshihiro Sugi, Yoichi Nishimura, Puspa Ratu 2006-10-10
7070650 Diamond film and method for producing the same Hitoshi Noguchi 2006-07-04
7042102 Semiconductor device Kazuto Tsuji, Kenji Asada, Sumikazu Hosoyamada 2006-05-09
6696754 Semiconductor module including a plurality of semiconductor devices detachably Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more 2004-02-24
6560219 Hybrid exchange, an exchange, and a re-arrangement method for STM data in an exchange Takashi Tabu, Masami Murayama, Sachiko Inoue, Hidehiko Suzuki, Kohei Ueki 2003-05-06
6509124 Method of producing diamond film for lithography Hitoshi Noguchi, Ikuo Okada 2003-01-21
6471940 Preparation of zeolite Yohei Kurata, Hideaki Hamada, Takaaki Hanaoka, Yoshihiro Sugi 2002-10-29
6472744 Semiconductor module including a plurality of semiconductor devices detachably Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more 2002-10-29
6465049 Method for preparation of diamond film Hitoshi Noguchi 2002-10-15
6376977 Silicon electrode plate Makoto Kawai, Keiichi Goto, Kazuyoshi Tamura, Toshimi Kobayashi 2002-04-23
6333564 Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada +6 more 2001-12-25
6288444 Semiconductor device and method of producing the same Mitsuo Abe, Yoshitsugu Katoh, Michio Hayakawa, Ryuji Nomoto, Mitsutaka Sato +3 more 2001-09-11
6122159 Electrostatic holding apparatus Kenichi Arai 2000-09-19
5965294 Hydrogen absorbing alloy electrode Yuichi Hamada, Hiroto Sugahara 1999-10-12
5834143 Frame-supported dustproof pellicle for photolithographic photomask Takashi Matsuoka, Meguru Kashida 1998-11-10
5804468 Process for manufacturing a packaged semiconductor having a divided leadframe stage Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi +5 more 1998-09-08