Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7508060 | Multi-chip semiconductor connector assemblies | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, Stephen Germain, Jay A. Yoder | 2009-03-24 |
| 7498195 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, Stephen St. Germain, Jay A. Yoder | 2009-03-03 |
| 7439100 | Encapsulated chip scale package having flip-chip on lead frame structure and method | Joseph K. Fauty, Denise Thienpont | 2008-10-21 |
| 7298034 | Multi-chip semiconductor connector assemblies | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, Stephen St. Germain, Jay A. Yoder | 2007-11-20 |
| 7202106 | Multi-chip semiconductor connector and method | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7202105 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Phillip Celaya, Joseph K. Fauty, Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7109064 | Method of forming a semiconductor package and leadframe therefor | Joseph K. Fauty, James H. Knapp | 2006-09-19 |
| 6768186 | Semiconductor device and laminated leadframe package | Joseph K. Fauty, Jay A. Yoder | 2004-07-27 |
| 6376266 | Semiconductor package and method for forming same | Kenneth Teik Kheong Low, Saat Shukri Embong, Chee Hiong CHEW, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |
| 6164523 | Electronic component and method of manufacture | Joseph K. Fauty, Michael J. Seddon | 2000-12-26 |
| 6081031 | Semiconductor package consisting of multiple conductive layers | Albert J. Laninga, James H. Knapp, Joseph K. Fauty, William F. Burghout | 2000-06-27 |
| 5886400 | Semiconductor device having an insulating layer and method for making | Reginald K. Asher | 1999-03-23 |
| 5785791 | Method of manufacturing semiconductor component | Reginald K. Asher, Mohan L. Sanduja, Felicia Dragnea | 1998-07-28 |
| 5309027 | Encapsulated semiconductor package having protectant circular insulators | — | 1994-05-03 |